| Allicdata Part #: | ATS-H1-210-C1-R0-ND |
| Manufacturer Part#: |
ATS-H1-210-C1-R0 |
| Price: | $ 7.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-210-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.76683 |
| 30 +: | $ 6.39072 |
| 50 +: | $ 6.01474 |
| 100 +: | $ 5.63882 |
| 250 +: | $ 5.26289 |
| 500 +: | $ 4.88697 |
| 1000 +: | $ 4.79300 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is integral to the operation of electronic devices, as inadequate thermal management significantly diminishes performance and even leads to complete system failure. Heat sinks are one of the most important components of a thermal management system, as they are employed to dissipate heat away from critical components. The ATS-H1-210-C1-R0 heat sink is an ideal solution for applications requiring a compact, low-power heat sink solution. This article will discuss the application fields and working principle of the ATS-H1-210-C1-R0 heat sink.
Application Fields
The ATS-H1-210-C1-R0 heat sink is specially designed for low-power applications. It excels in applications where the heat produced by electronic components needs to be dissipated in an efficient manner. This heat sink is ideal for single board computers (SBCs), embedded systems, and other small form factor applications where space is a critical factor. Additionally, the ATS-H1-210-C1-R0 can be used in applications where the components are overloaded or crowded, such as in industrial automation systems, medical devices, gaming consoles, and traffic lights. By using the ATS-H1-210-C1-R0, the components can be thermally matched to ensure an optimal life span of the device.
Working Principle
The ATS-H1-210-C1-R0 heat sink features a low-profile design with an integrated fan. The heat sink is made of high-quality aluminum, which maximizes the heat transfer between the heat source and the heat sink. The fan dissipates the heat generated by the components to the outside environment, allowing for optimal performance. The fan is powered by a variable speed controller, which provides flexibility and efficiency in dissipating the thermal load. The air flow generated by the fan will depend on the speed of the controller. Additionally, the heat sink is designed to be compatible with a variety of mounting systems.
The ATS-H1-210-C1-R0 can handle up to 14 watts of power at up to 70 degrees Celsius, with a minimum airflow requirement of 16cfm. This makes it suitable for applications where low-power components are employed. Additionally, it has an operating temperature range of -40°C to 70°C, ensuring reliable operation in temperatures ranging from hot to cold. The heat sink offers excellent thermal management performance with low power consumption, which makes it an ideal solution for temperature-sensitive applications.
Conclusion
The ATS-H1-210-C1-R0 heat sink is an ideal solution for applications requiring a small, low-power heat sink solution. It features a low-profile design with an integrated fan, which allows for excellent thermal management performance with low power consumption. Additionally, the fan is powered by a variable speed controller which provides flexibility and efficiency in dissipating the thermal load. Moreover, it has an operating temperature range of -40°C to 70°C, allowing for reliable operation in temperatures ranging from hot to cold. The ATS-H1-210-C1-R0 heat sink is ideal for single board computers, embedded systems, and other small form factor applications where space is a critical factor.
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