ATS-H1-24-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-H1-24-C1-R0-ND

Manufacturer Part#:

ATS-H1-24-C1-R0

Price: $ 6.73
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-H1-24-C1-R0 datasheetATS-H1-24-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.06123
30 +: $ 5.72418
50 +: $ 5.38751
100 +: $ 5.05084
250 +: $ 4.71412
500 +: $ 4.37739
1000 +: $ 4.29321
Stock 1000Can Ship Immediately
$ 6.73
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are devices that help to dissipate heat buildup in electronic devices such as computers and other electronic devices. The ATS-H1-24-C1-R0 is a specially designed heat sink that is developed to meet current application fields and standards in the thermal design industry. It is designed to be used in applications such as automotive, telecommunications, consumer electronics, and industrial applications. The device offers superior thermal management performance providing reliable protection from the harmful effects of heat.

The ATS-H1-24-C1-R0 is a one-piece heat sink with an anodized aluminum construction and an extruded aluminum fins. The unit is designed for a wide operating range from -20°C to +50°C. The device has a built-in fan and is available with either a 2-pin or a 4-pin connector to connect to your application. The fan can be adjusted for speed, and a fan speed control option can also be purchased.

The ATS-H1-24-C1-R0 operates on the principle of heat transfer. As heat is transferred away from the device, it is then released into the environment. Heat sinks allow heat to be able to dissipate more efficiently due to their greater surface area and fins, which allow more air to pass around and thus cool the heat source. The fins also create turbulence within the air current which helps to increase the cooling efficiency.

The ATS-H1-24-C1-R0 utilizes a combination of direct heat transfer technologies such as conduction, convection, and radiation to effectively dissipate heat away from the device. Conduction is the direct transfer of heat through a solid material such as aluminum and is the primary mode of heat transfer used in the ATS-H1-24-C1-R0. Convection is the process by which heat is transferred through a liquid or gas, such as air or oil. It is important to note that convection is an essential component of effective heat management, as heat dissipates more quickly when air is able to move freely. Radiation is the transfer of energy through the air and is another form of heat transfer used in the ATS-H1-24-C1-R0.

The ATS-H1-24-C1-R0 is designed to provide superior cooling performance while being easy to install and maintain. The device is easy to install due to its slim profile and simple design, and the fins allow the device to be placed in tight spaces while providing maximum thermal performance. The device is also highly reliable and efficient, helping to keep electronic devices cool even during long hours of operation. The device is environmentally friendly, as it does not produce any noise or vibration.

The ATS-H1-24-C1-R0 is a powerful and reliable heat sink that is perfectly suited for a variety of applications. Its superior cooling performance, sleek design, and low profile make it an ideal choice for cooling a wide range of electronic hardware. This device helps to keep sensitive components protected from heat buildup, ensuring the long-term reliability of your electronic devices.

The specific data is subject to PDF, and the above content is for reference

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