ATS-H1-75-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are designed to dissipate heat away from the source, in order to prevent possible damage associated with extreme temperatures. Among the various types available are ATS-H1-75-C3-R0, which has become increasingly popular for its specific application field and working principle. This paper aims to shed light on the features of this particular thermal pad and how it works, as well as discuss its application field and working principle.

Overview of the ATS-H1-75-C3-R0 Thermal - Heat Sink

ATS-H1-75-C3-R0 thermal pads are small, lightweight aluminum heat sinks designed to dissipate heat away from components to prevent overheating. Currently, they are most commonly used for ICs (integrated circuits), DIP (dual-in-line package) chips and SSOP (small-scale packages) chips. The ATS-H1-75-C3-R0 thermal pad has a unique design with an alloy back substrate, allowing for increased heat dissipation capabilities. This thermal pad is also easy to install and requires minimal hardware and assembling time.

Application Field and Working Principle of ATS-H1-75-C3-R0 Thermal - Heat Sinks

The primary application field of ATS-H1-75-C3-R0 thermal pads is in high-powered electronics such as computers, gaming consoles, and other electronic devices that require effective cooling solutions. The heat generated by such powerful electronics can cause damage to components or even total failure of the device if not managed properly, thus the need for effective cooling solutions.The main working principle of ATS-H1-75-C3-R0 thermal pads is their ability to dissipate heat away from its source through the use of thermal conductive pads. When contact is made between the thermal pad and the component, the heat is transferred away from the component to the thermal pad. This is then dissipated away from the component through the heat sink, resulting in a cooling effect.

Advantages of ATS-H1-75-C3-R0 Thermal - Heat Sinks

There are numerous advantages to employing ATS-H1-75-C3-R0 thermal pads in-place of other cooling solutions. For one, the thermal pads are designed with an aluminium alloy back substrate, providing greater strength and durability. Moreover, they are also lightweight and compact, making them ideal for small-scale applications. These same features also make ATS-H1-75-C3-R0 thermal pads highly effective when it comes to cooling solutions. Furthermore, they are easy to install and require minimal hardware and assembling time.

Conclusion

In conclusion, ATS-H1-75-C3-R0 thermal pads are a popular option when it comes to cooling solutions. With their lightweight and compact design, they are well-suited for small-scale applications, while their aluminium alloy back substrate and effective heat dissipation capabilities lend them well to high-powered electronics. Finally, the ease of assembly and installation of these thermal pads is a major advantage. All in all, ATS-H1-75-C3-R0 thermal pads offer an efficient and effective solution to overheating issues and should be considered as an option when seeking out cooling solutions.

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