| Allicdata Part #: | ATS-H1-96-C3-R0-ND |
| Manufacturer Part#: |
ATS-H1-96-C3-R0 |
| Price: | $ 6.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-96-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.26913 |
| 30 +: | $ 5.92095 |
| 50 +: | $ 5.57260 |
| 100 +: | $ 5.22434 |
| 250 +: | $ 4.87605 |
| 500 +: | $ 4.52776 |
| 1000 +: | $ 4.44069 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.73°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology has become essential for new technology products due to the increasing processing power of computing devices and the need to meet steady and often increasing performance standards. One of the most commonly used components in thermal management technology is a heat sink. The ATS-H1-96-C3-R0 heat sink is an important heat sink solution that provides superior performance and reliability for numerous applications.This heat sink is designed to help reduce thermal cycle rates and dissipate heat away from sensitive components, thus preserving components’ lifespan and preventing heat related malfunctions. The ATS-H1-96-C3-R0 provides better power dissipation through its high thermal conductivity, which helps maintain effective system cooling.
The ATS-H1-96-C3-R0 is designed with a multi-fin array, which optimizes heat absorption and dissipation. This multi-fin array helps to increase the surface area of the heat sink, which allows more efficient heat transfer. Additionally, the ATS-H1-96-C3-R0 is designed with CNC machined aluminum fins that provide improved strength and durability. This design also ensures uniform fin spacing, which maximizes heat transfer from the component to the fins.
The heat sink’s working principle is based on thermodynamics, which states that heat naturally migrates from an area of higher temperature to an area of lower temperature. Heat sinks employ the principles of convection and conduction to achieve this. Convection works by creating air movement around the heat sink fins, which acts as a cooling medium for the heat sink. Conduction works by transferring the heat into the fins through direct contact. The fins then dissipate the heat away from the components, allowing them to function at lower temperatures.
The ATS-H1-96-C3-R0 can be used in a variety of different applications, such as military and aerospace, power supplies, communications and consumer electronics. The superior performance of the ATS-H1-96-C3-R0 makes it ideal for applications that require both powerful cooling and reliability. This heat sink is also highly compatible with a variety of different components, and is designed to fit into tight spaces without compromising performance.
The ATS-H1-96-C3-R0 heat sink is an important component in thermal management technology due to its superior performance and reliable operation. Through its effective convection and conduction designs, the ATS-H1-96-C3-R0 is able to efficiently transfer heat away from sensitive components and maintain effective system cooling. It is compatible with a wide range of applications, making it an ideal solution for various thermal management needs.
The specific data is subject to PDF, and the above content is for reference