ATS-HP-D9.5L250S69W-158 Allicdata Electronics
Allicdata Part #:

ATS2568-ND

Manufacturer Part#:

ATS-HP-D9.5L250S69W-158

Price: $ 13.71
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: ROUND HEATPIPE 70W 9.5X250MM
More Detail: Heat Sink Copper Heat Pipe
DataSheet: ATS-HP-D9.5L250S69W-158 datasheetATS-HP-D9.5L250S69W-158 Datasheet/PDF
Quantity: 50
1 +: $ 12.45510
10 +: $ 11.76530
25 +: $ 11.07340
50 +: $ 10.38130
100 +: $ 9.68912
250 +: $ 8.99703
500 +: $ 8.82406
Stock 50Can Ship Immediately
$ 13.71
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Package Cooled: --
Attachment Method: Epoxy or Solder
Shape: Round
Length: 9.843" (250.00mm)
Width: --
Diameter: 0.374" (9.50mm) OD
Height Off Base (Height of Fin): --
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: --
Description

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Thermal - Heat Sinks are an important component in cooling process systems. Heat sinks are typically used to dissipate heat away from electronics components. Heat can be generated from the components themselves or from the external environment. In both cases, the heat must be eliminated in order for the device to continue to operate. The thermal heat sink is a significant part of this process. This article will provide an overview of the ATS-HP-D9.5L250S69W-158 thermal - heat sink application field and working principle.

The ATS-HP-D9.5L250S69W-158 is a thermal - heat sink designed for use with processors and other microelectronic devices within a wide range of applications. The heat sinks are specifically designed to provide an effective cooling solution for modern and complex devices. The ATS-HP-D9.5L250S69W-158 is composed of an extruded aluminium heatsink material and anodized for corrosion and abrasion resistance. This thermal - heat sink comes in a variety of sizes and shapes, which can be customized to meet the specific needs of the customer.

The ATS-HP-D9.5L250S69W-158 thermal - heat sink utilizes natural convection of air to withdraw heat from the heat source. Heat is drawn away from the processor in the form of hot air and circulated through the heat sink fins. As the air warms, it rises, creating an airflow to and from the processor. This forced airflow dissipates the heat and keeps the processor cool. The larger the surface area of the heat sink, the higher the rate of heat transfer and the better the performance of the device.

The ATS-HP-D9.5L250S69W-158 thermal - heat sink offers a wide range of applications. It is commonly used in servers, computers, laptops, and other consumer electronics devices. Its high-durability makes it resistant to shocks and vibrations, which makes it ideal for use in harsh working environments. In addition, its low-noise operation makes it perfect for use in noise-sensitive applications. The ATS-HP-D9.5L250S69W-158 is capable of working in a variety of temperature ranges, which makes it suitable for both low-temperature and high-temperature environments.

The ATS-HP-D9.5L250S69W-158 thermal - heat sink is an excellent solution for dissipating heat away from intricate and sensitive electronics components. Its design and materials enable efficient air circulation, which in turn maximizes the effectiveness of the cooling process. The ATS-HP-D9.5L250S69W-158 thermal - heat sink is an affordable and versatile solution that can meet the cooling needs of both low-temperature and high-temperature applications. It is designed to provide an efficient and reliable cooling solution for any type of application.

The specific data is subject to PDF, and the above content is for reference

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