Allicdata Part #: | ATS2569-ND |
Manufacturer Part#: |
ATS-HP-D9.5L300S58W-159 |
Price: | $ 14.15 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | ROUND HEATPIPE 58W 9.5X300MM |
More Detail: | Heat Sink Copper Heat Pipe |
DataSheet: | ATS-HP-D9.5L300S58W-159 Datasheet/PDF |
Quantity: | 48 |
1 +: | $ 12.87090 |
10 +: | $ 12.15840 |
25 +: | $ 11.44330 |
50 +: | $ 10.72830 |
100 +: | $ 10.01290 |
250 +: | $ 9.29782 |
500 +: | $ 9.11897 |
Series: | -- |
Part Status: | Active |
Type: | Heat Pipe |
Package Cooled: | -- |
Attachment Method: | Epoxy or Solder |
Shape: | Round |
Length: | 11.811" (300.00mm) |
Width: | -- |
Diameter: | 0.374" (9.50mm) OD |
Height Off Base (Height of Fin): | -- |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Copper |
Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-HP-D9.5L300S58W-159 Thermal - Heat Sink is designed to provide superior cooling performance and thermal management in a range of applications. It employs a unique and innovative design that combines the best thermal management performance with low-profile and light weight. This makes it an ideal choice for applications which require efficient thermal management, yet need to conserve space and reduce weight.
The ATS-HP-D9.5L300S58W-159 Heat Sink features an optimized cooling surface and finely engineered thermal management fins to provide enhanced cooling performance. The fins are designed to maximize air contact for improved cooling efficiency. This combined with the light-weight, low-profile construction makes the ATS-HP-D9.5L300S58W-159 Thermal - Heat Sink an ideal choice for many electronic devices. The design also allows for high airflow directed through the fins for maximum cooling performance.
The ATS-HP-D9.5L300S58W-159 Thermal - Heat Sink\'s working principle is based on simple convection. Heat from an electronic device is transferred to the heat sink\'s surface where it is immediately dissipated through the fins. This ensures that the device retains a safe operating temperature, as excessive heat buildup can lead to thermal damage to the components and ultimately result in device failure. The heat sink also helps to increase the life of the device by protecting it from extreme temperatures.
The ATS-HP-D9.5L300S58W-159 Thermal - Heat Sink is suitable for a wide range of electronic devices including computers, servers, routers, TVs, medical equipment, surveillance systems, industrial equipment and many more. It is also a great choice for embedded systems, as its low-profile design and light-weight construction make it an ideal solution for tight spaces. The heat sink is constructed from high-grade aluminum which is corrosion resistant and provides durability in harsh environments.
The ATS-HP-D9.5L300S58W-159 Thermal - Heat Sink is an efficient and reliable thermal solution, designed to meet the cooling needs of a variety of applications. Its high-quality construction and maximum cooling performance make it an ideal choice for both residential and commercial settings. In addition, its unique and innovative design increases the lifespan of the electronic device, ensuring that it will continue to perform optimally for many years to come.
The specific data is subject to PDF, and the above content is for reference