ATS-HP-D9.5L350S49W-160

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Thermal Heat Sinks are a type of heat management solution, typically used for cooling electronics, that provide an efficient and effective method for dispersing heat. Heat sinks are typically made from aluminum or copper and can be found in a range of computing, and other electronic applications such as radio communications and medical equipment. ATS-HP-D9.5L350S49W-160 is an example of a thermal heat sink designed and manufactured to provide reliable cooling performance.

This heat sink features a robust construction that consists of 9.5" length, 3.5" width, and 0.5” height rear mounted fins. The robust low profile design of the ATS-HP-D9.5L350S49W-160 allows the heat sink to be installed in confined areas where little space is available. Additionally, the ATS-HP-D9.5L350S49W-160 also contains pre-installed thermally conductive grease to ensure the heat sink is secure and properly deployed.

The primary function of the ATS-HP-D9.5L350S49W-160 is to transfer heat away from any source, such as an electronic component. This type of thermal heat sink acts is an active thermal solution, as it increases the speed and efficiency of heat transfer from the source to the finish object using air flow. This particular model features an innovative fin design that creates air turbulence which strongly accelerates the rate of heat extraction.

The ATS-HP-D9.5L350S49W-160 thermal heat sink is particularly suitable for applications with limited space, thanks to its low profile design. Additionally, this model is specifically designed to be used on a variety of text applications, such as state of the art tablet devices, thin-client computers and gaming devices. This makes the ATS-HP-D9.5L350S49W-160 suitable for a range of end-use applications, without having to worry about compatibility. In addition to this, the ATS-HP-D9.5L350S49W-160 is suitable for use with devices that require restrictions on operating temperatures.

When properly installed, the ATS-HP-D9.5L350S49W-160 offers superior performance in relation to thermal management compared to traditional passive thermal solutions, such as fans and thermal interface material. This is because the heat sink utilizes an active cooling system to move the heat away from the source. The fins also help to move the air around to create air turbulence, increasing the rate of heat absorption.

The ATS-HP-D9.5L350S49W-160 thermal heat sink is also designed for use with specific applications. This model is particularly suitable for applications which don’t require a heatsink cover, such as laptops and other mobile devices. It has been designed specifically to protect delicate surfaces from thermal energy by dissipating heat away from the source. Furthermore, the ATS-HP-D9.5L350S49W-160 is designed to be used in applications which require a low acoustic profile, as its low profile design means it does not require the use of additional fans.

Overall, the ATS-HP-D9.5L350S49W-160 is an ideal choice for a range of applications, ranging from laptops and tablets to gaming systems. The compact design and built-in pre-installed thermally conductive grease provide a reliable and effective thermal management system for any system. Furthermore, its low profile design means it can be used in portable applications and is suitable for devices which require reliable heating solutions.

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