| Allicdata Part #: | ATS2573-ND |
| Manufacturer Part#: |
ATS-HP-D9.5L500S34W-163 |
| Price: | $ 16.01 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | ROUND HEATPIPE 35W 9.5X500MM |
| More Detail: | Heat Sink Copper Heat Pipe |
| DataSheet: |  ATS-HP-D9.5L500S34W-163 Datasheet/PDF |
| Quantity: | 50 |
| 1 +: | $ 14.55300 |
| 10 +: | $ 13.74280 |
| 25 +: | $ 12.93420 |
| 50 +: | $ 12.12590 |
| 100 +: | $ 11.31750 |
| 250 +: | $ 10.50910 |
| 500 +: | $ 10.30700 |
| Series: | -- |
| Part Status: | Active |
| Type: | Heat Pipe |
| Package Cooled: | -- |
| Attachment Method: | Epoxy or Solder |
| Shape: | Round |
| Length: | 19.685" (500.00mm) |
| Width: | -- |
| Diameter: | 0.374" (9.50mm) OD |
| Height Off Base (Height of Fin): | -- |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Copper |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A thermal heat sink is a device used to manage excessive heat in electronic devices. In contrast to air cooling, a thermal heat sink offers a larger surface area for higher heat transfer efficiency with a lower amount of air flow. As such, it can effectively reduce the average temperature in an electronic device. The ATS-HP-D9.5L500S34W-163 is a heat sink specifically designed to dissipate the heat generated by large power semiconductors. This article will discuss the application field and working principle of the ATS-HP-D9.5L500S34W-163.
The ATS-HP-D9.5L500S34W-163 is a thermal heat sink designed for the power semiconductor industry. It is designed to fit most large power semiconductors, including IGBTs, MOSFETs, thyristors, and power transistors. The ATS-HP-D9.5L500S34W-163 has a maximum current carrying capacity of 9.5A. It has a thermal resistance of 0.6°C/W and is capable of dissipating up to 500W of heat per device. The heat sink is made of aluminum alloy and comes with a cast aluminum base and mounting hardware.
The ATS-HP-D9.5L500S34W-163 heat sink is primarily used in power and motor drive systems. It is also used in industrial machine controls, high power inverter applications, and high power DC to DC converter applications. In all of these applications, the heat sink plays an important role in dissipating the heat generated by the components. In particular, the heat sink helps maintain a stable temperature within the system, preventing the risk of component failure due to overheating.
The ATS-HP-D9.5L500S34W-163 is designed to transfer heat efficiently. It consists of a base plate, which is bolted to the component. Thermal compound, which acts as a thermal interface, is applied between the heat sink and the component in order to improve the thermal transfer between the two surfaces. Heat is then transferred from the component to the base plate, which is in contact with the heat sink. The heat sink is designed with fins and curved surfaces that allow air to pass through, which helps to absorb the heat from the base plate and dissipate it into the atmosphere.
In order to maximize the efficiency of the ATS-HP-D9.5L500S34W-163 heat sink, it is important to ensure that it is installed correctly. Care must be taken to ensure that the thermal compound is spread evenly and uniformly between the heat sink and the component, as well as the base plate and the heat sink. It is also important to ensure that the heat sink is mounted securely to the component, as any movement may cause the thermal compound to be disturbed, reducing the efficiency of the heat sink.
In summary, the ATS-HP-D9.5L500S34W-163 is a thermal heat sink designed for use in power semiconductor applications. It is designed to fit most large power semiconductors, and has a maximum current carrying capacity of 9.5A and a thermal resistance of 0.6°C/W. It is easy to install and has a large thermal transfer surface area, allowing it to efficiently dissipate the heat generated by the components. With its low profile design, the ATS-HP-D9.5L500S34W-163 can be installed in tight spaces, making it an ideal solution for many power electronic applications.
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