ATS-HP-D9.5L550S31W-164 Allicdata Electronics
Allicdata Part #:

ATS2574-ND

Manufacturer Part#:

ATS-HP-D9.5L550S31W-164

Price: $ 16.95
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: ROUND HEATPIPE 32W 9.5X550MM
More Detail: Heat Sink Copper Heat Pipe
DataSheet: ATS-HP-D9.5L550S31W-164 datasheetATS-HP-D9.5L550S31W-164 Datasheet/PDF
Quantity: 50
1 +: $ 15.40980
10 +: $ 14.55110
25 +: $ 13.69520
50 +: $ 12.83910
100 +: $ 11.98320
250 +: $ 11.12730
500 +: $ 10.91330
Stock 50Can Ship Immediately
$ 16.95
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Package Cooled: --
Attachment Method: Epoxy or Solder
Shape: Round
Length: 21.654" (550.00mm)
Width: --
Diameter: 0.374" (9.50mm) OD
Height Off Base (Height of Fin): --
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical to many modern electronic systems, as they become increasingly dependent on reliable cooling solutions. One of the most common methods for controlling heat is to use a heat sink, which is a device used to dissipate heat from a device or component. The ATS-HP-D9.5L550S31W-164 is one such heat sink, which offers an efficient and reliable solution for dissipating heat.

The ATS-HP-D9.5L550S31W-164 features a number of design features that make it ideal for use in thermal management applications. This heat sink is constructed from high-quality aluminum alloy that offers good thermal conductivity and structural rigidity. Its finned body is designed to maximize surface area for increased heat dissipation, and its 9.5mm thick fins provide for an even distribution of heat.

The ATS-HP-D9.5L550S31W-164 is designed for reliable thermal performance, with a maximum operating temperature of 125°C. This makes it suitable for use in a wide range of applications, such as automotive electronics, industrial machinery, and consumer electronics. It is also smaller than many comparable heat sinks, which makes it an ideal solution for applications where space is limited.

The ATS-HP-D9.5L550S31W-164 heat sink can be easily mounted on the device or component using either screws or clips. In order to ensure effective heat dissipation, it is important to ensure a good contact between the heat sink and the component itself. This can be achieved by using a thermal paste or a thermal pads, which are designed to help improve the heat transfer between the two surfaces.

The ATS-HP-D9.5L550S31W-164 heat sink is designed to work with standard fan and air flow systems, making it compatible with most modern systems. The heat sink works by transferring heat from the component to the fins, which then dissipate this heat to the surrounding air. This process can be further enhanced by using a fan to provide airflow over the fins, which helps to dissipate heat more quickly.

In conclusion, the ATS-HP-D9.5L550S31W-164 is an effective and reliable thermal management solution, that can be used in a variety of applications. Its design features make it ideal for use in applications where space is limited and heat management is critical. Its efficient heat dissipation makes it an excellent choice for any system that requires cooling, and its easy mounting and compatibility with most fans and air flow systems make it a reliable and convenient solution for any thermal management requirement.

The specific data is subject to PDF, and the above content is for reference

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