
Allicdata Part #: | ATS2306-ND |
Manufacturer Part#: |
ATS-HP-F6L300S13W-244 |
Price: | $ 7.91 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | FLAT HEATPIPE 13W 8.6X2X300MM |
More Detail: | Heat Sink Copper Heat Pipe |
DataSheet: | ![]() |
Quantity: | 50 |
1 +: | $ 7.19460 |
10 +: | $ 6.79455 |
25 +: | $ 6.39526 |
50 +: | $ 5.99546 |
100 +: | $ 5.59579 |
250 +: | $ 5.19606 |
500 +: | $ 5.09615 |
1000 +: | $ 4.99622 |
Series: | -- |
Part Status: | Active |
Type: | Heat Pipe |
Package Cooled: | -- |
Attachment Method: | Epoxy or Solder |
Shape: | Flat |
Length: | 11.811" (300.00mm) |
Width: | 0.339" (8.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.079" (2.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Copper |
Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management systems are essential for extending the life of electrical components. Thermal - heat sinks are designed to dissipate heat generated by electronic components. The ATS-HP-F6L300S13W-244 thermal - heat sink is a low profile fan-less heatsink that is designed to minimize space while achieving maximum heat dissipation.
The ATS-HP-F6L300S13W-244 thermal - heat sink consists of a baseplate with a variety of fins that are evenly spaced to create maximum surface area for heat transfer. The baseplate is made from aluminum, which is a great thermally conductive material, and it is also highly resistant to corrosion and oxidation. The fins are typically made from aluminum or copper, which are also good thermally conductive materials. The fins increase the total area of the heat sink so that a larger amount of air is exposed to the heat sink and provides a better means of transferring the heat away from the component.
The ATS-HP-F6L300S13W-244 thermal - heat sink is designed to work in conjunction with a fan and other cooling components to achieve maximum cooling efficiency. It is the perfect solution for applications that require reliable cooling without a fan. This type of heat sink is ideal for applications where space is an issue, such as in embedded systems or in places where a fan cannot be installed.
The primary purpose of a thermal - heat sink is to dissipate thermal energy for an electronic component. The thermal energy is transferred through the baseplate and fins to the ambient air so that it can be quickly cooled. The fins act as an area of increased surface area that increases the heat transfer rate. The ATS-HP-F6L300S13W-244 thermal - heat sink offer superior performance and is perfect for applications that require maximum heat transfer without the addition of a fan.
The ATS-HP-F6L300S13W-244 thermal - heat sink is well suited for a variety of applications, such as computers, medical equipment and electronic appliances. This type of heat sink is ideal for applications that require high performance and reliable cooling without the added noise of a fan. The ATS-HP-F6L300S13W-244 also features a patented pin technology that increases the heat transfer rate to ensure that components remain cool and reliable.
In conclusion, the ATS-HP-F6L300S13W-244 thermal - heat sink is a great choice for a variety of applications. It is designed to dissipate heat quickly and efficiently without the addition of a fan, making it ideal for embedded and other confined spaces. The patented pin technology increases the heat transfer rate, ensuring that components remain cool and reliable. This thermal - heat sink is a great choice for applications that require maximum cooling performance without the added noise of a fan.
The specific data is subject to PDF, and the above content is for reference