ATS-HP-F8L250S23W-358 Allicdata Electronics
Allicdata Part #:

ATS2420-ND

Manufacturer Part#:

ATS-HP-F8L250S23W-358

Price: $ 8.18
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: FLAT HEATPIPE 23W 11.4X2.5X250MM
More Detail: Heat Sink Copper Heat Pipe
DataSheet: ATS-HP-F8L250S23W-358 datasheetATS-HP-F8L250S23W-358 Datasheet/PDF
Quantity: 50
1 +: $ 7.44030
10 +: $ 7.02450
25 +: $ 6.61097
50 +: $ 6.19794
100 +: $ 5.78466
250 +: $ 5.37151
500 +: $ 5.26820
1000 +: $ 5.16489
Stock 50Can Ship Immediately
$ 8.18
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Package Cooled: --
Attachment Method: Epoxy or Solder
Shape: Flat
Length: 9.843" (250.00mm)
Width: 0.449" (11.41mm)
Diameter: --
Height Off Base (Height of Fin): 0.098" (2.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-HP-F8L250S23W-358 is a thermal sink manufactured by ATS. It is typically used as an auxiliary heat sink for a variety of applications such as cooling computers, small electronics, audio equipment, and many other electronic components. Thermal - Heat Sinks are designed to effectively manage and disperse heat away from critical components in order to prevent them from becoming overwhelmed or damaged. The ATS-HP-F8L250S23W-358 utilizes an innovative design to provide excellent heat dissipation capabilities.

The thermal sink consists of a base made of copper, which effectively absorbs and dissipates heat away from the thermally-sensitive components. On top of the copper base is a thermal interface material (TIM) that provides additional heat dissipation. The TIM is made of an elastic material such as silicone, which helps to transfer heat from the component into the dissipative sink. The lack of a soldered base reduces the risk of accidentally introducing a soldering defect which could potentially damage the component.

The ATS-HP-F8L250S23W-358 features a series of fins that rise from the copper base. These fins act as an extension to the surface area that tactically works to increase the heat dissipation capabilities. This design helps to increase the surface area along the base, so that more heat can flow away from the system. As a result, components that utilize the thermal sink will remain operating efficiently and within their desired environment temperatures.

The ATS-HP-F8L250S23W-358 is designed for low profile applications where space is extremely limited. The low profile design and lightweight construction of the base makes it easy to mount in tight spaces, such as small enclosures or narrow racks. The thermal sink may also be secured with screws or bolts which may be purchased separately.

In addition to the ATS-HP-F8L250S23W-358, the company also produces several other thermal sinks that are used in various applications. This helps to guarantee that customers will be able to find the right product for their needs. The high-performance components of the ATS-HP-F8L250S23W-358 make it a great choice for any application needing efficient heat dissipation solutions.

The specific data is subject to PDF, and the above content is for reference

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