| Allicdata Part #: | ATS2506-ND |
| Manufacturer Part#: |
ATS-HP-F8L500S13W-444 |
| Price: | $ 12.87 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | FLAT HEATPIPE 13W 10.1X5X500MM |
| More Detail: | Heat Sink Copper Heat Pipe |
| DataSheet: |  ATS-HP-F8L500S13W-444 Datasheet/PDF |
| Quantity: | 48 |
| 1 +: | $ 11.69280 |
| 10 +: | $ 11.04450 |
| 25 +: | $ 10.39470 |
| 50 +: | $ 9.74512 |
| 100 +: | $ 9.09538 |
| 250 +: | $ 8.44571 |
| 500 +: | $ 8.28331 |
| Series: | -- |
| Part Status: | Active |
| Type: | Heat Pipe |
| Package Cooled: | -- |
| Attachment Method: | Epoxy or Solder |
| Shape: | Flat |
| Length: | 19.685" (500.00mm) |
| Width: | 0.398" (10.11mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.197" (5.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Copper |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an essential component in the engineering process of integrating high-performance, energy efficient solutions into modern electronics. Heat sinks are designed to optimize the thermal performance and efficiency of any component or system by transferring heat away from the device and into the ambient atmosphere. The ATS-HP-F8L500S13W-444 is a high performance heat sink designed to provide exceptional thermal performance and efficiency for various applications.
The ATS-HP-F8L500S13W-444 is a die-cast aluminum heat sink designed to dissipate high loads of heat from sensitive components. It features a large heat sink frame with fins that are deployed in a honeycomb pattern for maximum surface area. The die-cast aluminum ensures maximum heat dissipation and excellent thermal performance which ensures thermal stability for sensitive components. The fins are positioned in such a way that it allows air to freely circulate throughout the space, ultimately providing efficient heat transfer from the heat sink to the ambient atmosphere.
The ATS-HP-F8L500S13W-444 is an ideal choice for applications that require high heat dissipation. It is suitable for automotive, telecommunications, and industrial applications, and is designed to meet many industrial standards, and is compatible with most heat sink-mounted components. Its high performance nature makes it ideal for applications that require greater heat dissipation, such as power electronics, high-performance gaming hardware, and server applications.
The ATS-HP-F8L500S13W-444 heat sink utilizes a patented “Heat Spreader Technology”, which is an innovative approach to thermal management. The technology works by utilizing the conduction properties of aluminum to quickly and efficiently spread the heat from the device into the ambient atmosphere. The heat spreader material absorbs the heat from the source and rapidly distributes the heat across its entire surface area, resulting in more uniform and efficient heat transfer. The heat spreader also helps to reduce the temperature gradient between the heat source and the ambient atmosphere.
In addition, the ATS-HP-F8L500S13W-444 also features a unique “Air Pre-Heater” which is designed to reduce air temperature prior to entering the heat sink. The Air Pre-Heater works by capturing incoming air, warming it before it enters the heat sink, and delivering it at a constant temperature, providing enhanced thermal performance. This feature helps to reduce hot spots by eliminating unpredictable air temperatures which can lead to thermal imbalances and decrease the reliability of components.
The ATS-HP-F8L500S13W-444 is an advanced thermal management solution which offers high thermal performance, efficiency, and reliability. Its patented Heat Spreader Technology and Air Pre-Heater are designed to provide enhanced thermal performance and reduce hot spots, making it an ideal solution for a wide range of applications. It is compatible with most components and meets a variety of industrial standards, making it a great choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference