ATS-HP-F8L75S82W-400 Allicdata Electronics
Allicdata Part #:

ATS2462-ND

Manufacturer Part#:

ATS-HP-F8L75S82W-400

Price: $ 5.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: FLAT HEATPIPE 82W 10.7X4X75MM
More Detail: Heat Sink Copper Heat Pipe
DataSheet: ATS-HP-F8L75S82W-400 datasheetATS-HP-F8L75S82W-400 Datasheet/PDF
Quantity: 50
1 +: $ 5.04000
10 +: $ 4.90455
25 +: $ 4.63176
50 +: $ 4.35935
100 +: $ 4.08694
250 +: $ 3.81448
500 +: $ 3.54201
1000 +: $ 3.47390
Stock 50Can Ship Immediately
$ 5.54
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Package Cooled: --
Attachment Method: Epoxy or Solder
Shape: Flat
Length: 2.953" (75.00mm)
Width: 0.419" (10.65mm)
Diameter: --
Height Off Base (Height of Fin): 0.157" (4.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are an essential part of many modern electronic systems. ATS-HP-F8L75S82W-400 is a highly efficient, lightweight and compact heat sink for use in a variety of applications. With its superior thermal performance, this product makes an ideal choice for applications requiring a reliable solution to dissipate the heat generated by electronic components.

The ATS-HP-F8L75S82W-400 heat sink is made using high-performance aluminum alloy and precision machining techniques to ensure maximum heat dissipation. The product also features a unique airflow design which provides efficient heat conduction and dissipation. Thanks to its optimized design, the ATS-HP-F8L75S82W-400 offers a high level of cooling efficiency, even under extreme temperatures.

This heat sink is designed for a variety of applications such as servers, storage systems, embedded systems, industrial control systems and more. It’s also suitable for cooling high-power components such as CPUs, GPUs, and ASICs. The heat sink is easy to install, comes with a wide array of mounting options, and offers advanced thermal performance.

The ATS-HP-F8L75S82W-400 heat sink\'s working principle is based on the thermodynamics law of convection. This principle states that heat is transferred from the hot to the cold object. As such, the product relies on the natural flow of air to draw the hot air away from the component and direct it to the sink, where it is dissipated to the environment.

The flow of air is generated by the natural convection process, where the heated air rises through the cooling fins to the top of the sink. The cold air is then pulled in from the sides to fill the area that the hot air has vacated. This process creates a continuous cycle of air cooling the components within the device.

The ATS-HP-F8L75S82W-400\'s highly efficient design ensures that it can effectively dissipate the heat generated by powerful components without causing any damage to them. Its large cooling surface also allows for a higher thermal capacity, allowing it to cool more components, thus reducing the likelihood of system failure. In addition, this product features a robust construction that can withstand harsh environmental conditions.

Overall, the ATS-HP-F8L75S82W-400 is an ideal choice for applications that require a reliable, lightweight, and efficient thermal heat sink. With its advanced cooling performance, this product has become increasingly popular in the electronics industry and is widely used in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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