ATS-P1-07-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-P1-07-C1-R0-ND

Manufacturer Part#:

ATS-P1-07-C1-R0

Price: $ 3.10
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-P1-07-C1-R0 datasheetATS-P1-07-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.79342
30 +: $ 2.71824
50 +: $ 2.56725
100 +: $ 2.41618
250 +: $ 2.26518
500 +: $ 2.18966
1000 +: $ 1.96314
Stock 1000Can Ship Immediately
$ 3.1
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are used to provide thermal insulation and cool heat-generating components in a given environment. ATS-P1-07-C1-R0 application field and working principle are one type of thermal heat sink.

This type of heat sink is mainly used in computers and communications equipment. The main purpose of this heat sink is to dissipate heat generated by components such as processors, memory chips and other heat-generating components. It can also be used to reduce or eliminate the production of unwanted noise and vibration due to its temperature insulation properties.

The working principle of ATS-P1-07-C1-R0 heat sinks is based on the principle of thermal conduction. Heat generated by the components is conducted to the heat sink via heat pipes. Inside the heat sink, fins or collectors are attached to the base of the heat sink. These fins or collectors act as heat dissipating surfaces and help in dissipating the heat generated by the components to the surrounding environment.

The material used for making ATS-P1-07-C1-R0 heat sinks is generally aluminium or copper. Aluminium is the most common type of material used as it is more resistant to corrosion and has a higher thermal conductivity than copper. It also has a higher thermal dissipation rate and is very good at dissipating the generated heat. Copper is also an ideal material for making this type of heat sink as it has excellent electrical conductivity and can easily transfer the heat from the components.

Additionally, most modern heat sinks also use a fan to ensure that the heat is dissipated properly. The fan draws in the hot air that has been absorbed by the heat sink and forces it out into the environment. This helps to keep the components cool and prevent them from overheating.

To ensure the effective dissipation of the heat generated by the components, the fan and the fins of the ATS-P1-07-C1-R0 heat sink must be properly placed and positioned. The fan should be placed away from the components and the fins should be placed in close proximity to the components so that the heat is transferred to the fins more easily.

For optimal cooling and heat dissipation, it is important to ensure that the ATS-P1-07-C1-R0 heat sink is properly installed in the system. Typically, the heat sink should be placed in a way that the air flow is unobstructed. The fan should also be placed in an area where it will have a good circulation of air, and the fins should be placed in an area with good air flow.

Moreover, it is important to ensure that the heat sink is well-secured in the system as it can be easily dislodged and can cause damage to the components if not properly secured. Proper installation of the heat sink is also important to ensure the effective dissipation of the heat generated by the components.

In conclusion, ATS-P1-07-C1-R0 application field and working principle is a type of thermal heat sink designed for high-performance computing and communication systems and other heat consuming applications. It works on the principle of thermal conduction, utilizing heat pipes and fan cooling to dissipate the generated heat. Proper installation and maintenance of the heat sink help in ensuring efficient and effective cooling of the components for optimum performance.

The specific data is subject to PDF, and the above content is for reference

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