| Allicdata Part #: | ATS-P1-109-C1-R1-ND |
| Manufacturer Part#: |
ATS-P1-109-C1-R1 |
| Price: | $ 4.29 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-109-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.86316 |
| 30 +: | $ 3.64875 |
| 50 +: | $ 3.43400 |
| 100 +: | $ 3.21943 |
| 250 +: | $ 3.00480 |
| 500 +: | $ 2.79017 |
| 1000 +: | $ 2.73651 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are a common form of cooling in electronics and other industrial applications. They come in a variety of shapes and sizes, including square, rectangular, and circular. Many of the more popular models are composed of a base material, such as aluminum, copper, or stainless steel, to which heat dissipating fins are attached.
The ATS-P1-109-C1-R1 application field and working principle is a type of heat sink that utilizes a highly efficient heat dissipation design. It is composed of a base of anodized aluminum alloy with soldered copper alloy fins attached. The base material is chosen for its high thermal conductivity, while the copper alloy fins are chosen for their ability to absorb and dissipate heat quickly and efficiently.
The ATS-P1-109-C1-R1 application field and working principle is designed to be used in a variety of applications, such as digital signal processors (DSPs), network cards and integrated circuits (ICs). It is also a popular choice for cooling RAM, CPU and other components in high-end PCs. The ATS-P1-109-C1-R1 is also frequently used in industrial applications, such as medical imaging systems.
The working principle of the ATS-P1-109-C1-R1 is simple. Heat generated from a component is transferred via a thermal interface to the heat sink base. The heat is then dissipated through the copper alloy fins, creating a strong convection process. The contoured copper alloy fins also create laminar flow which facilitates more efficient heat exchange.
When choosing a suitable heat sink for an application, a number of factors must be considered. These factors include the type and size of the component being cooled, the operating temperature range, the desired cooling capacity, and the mounting options. The ATS-P1-109-C1-R1 is a highly effective cooling solution that can be used in a variety of applications and used in conjunction with a number of different components.
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