| Allicdata Part #: | ATS-P1-125-C1-R0-ND |
| Manufacturer Part#: |
ATS-P1-125-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-125-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is of utmost importance in today\'s electronics world. Modern design has put an increasing demand in power, size, and reliability which have forced designers to create more efficient and compact thermal solutions.
ATS-P1-125-C1-R0 is a thermal management component designed to meet these modern challenges. It is a highly efficient heat sink designed to improve power performance and reliability by dissipating heat away from sensitive electronic components without requiring excessive operating power.
The ATS-P1-125-C1-R0 operates on a unique airflow principle of two thermal management technologies – thermophoresis and convection. These two technologies work together to push hot air away from electronic components and ensure efficient cooling. As hot air is pushed away from the component, cooler air is drawn in, leading to improved thermal performance.
To ensure efficient operation, the ATS-P1-125-C1-R0 combines high airflow capacity and thermally conductive material. The air flow capacity prevents hot air from building up in surrounding components while the thermally conductive material creates an effective thermal bridge between the components to be cooled and the air flow from the fan. This combination ensures that the component operates coolly and efficiently and is less susceptible to thermal runaway or other thermal issues.
In addition to thermophoresis and convection, the ATS-P1-125-C1-R0 also features a unique mounting system which ensures the component is quickly and easily mounted in a multitude of applications. The quick mount feature eliminates nails, screws, adhesives, and other complex fastening systems, making assembly and installation time much faster.
The ATS-P1-125-C1-R0 is a highly efficient thermal management component suitable for a wide variety of applications across electronics. It is ideal for applications where power savings, size reduction, and thermal management are important considerations. It is also well suited for high power electronics, LED lighting, and optical drives. With its combination of thermally efficient operation, quick mount system, and small size, the ATS-P1-125-C1-R0 is a great choice for any thermal management challenge.
The specific data is subject to PDF, and the above content is for reference