ATS-P1-157-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-P1-157-C3-R0-ND

Manufacturer Part#:

ATS-P1-157-C3-R0

Price: $ 4.05
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-P1-157-C3-R0 datasheetATS-P1-157-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.67794
30 +: $ 3.47382
50 +: $ 3.26957
100 +: $ 3.06520
250 +: $ 2.86086
500 +: $ 2.65651
1000 +: $ 2.60542
Stock 1000Can Ship Immediately
$ 4.05
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-P1-157-C3-R0 is a thermal-heat sink designed for applications which require excellent heat dissipation performance. It has a compact, lightweight design that is both economical and reliable. The device is capable of dissipating up to 14.5 watts and can be mounted in a variety of orientations.

The ATS-P1-157-C3-R0 utilizes a unique, three-stage heat sink design. The heat sink features a number of aluminum fins arranged in a conical shape. The first stage is a series of flat fins which are positioned in a circular pattern around the center of the device. The fins are made of aluminum and are designed to increase surface area, thus allowing for more efficient heat dissipation.

The second stage consists of a series of curved fins positioned to move air past the heat sink and out of the device. This stage is designed to provide a greater volume of air flow over the device, which increases heat transfer performance. The third stage is a series of narrow fins which are arranged in a radial pattern. These fins are designed to provide stability to the device, as well as providing additional heat dissipation.

The device\'s working principle is based on convection. Heat is transferred from the device to the fins, where it is then released into the surrounding air. This process is accelerated by the design of the device, which maximizes the surface area exposed to the air. This accelerated process increases the rate of heat transfer, allowing for higher levels of heat dissipation from the device.

The ATS-P1-157-C3-R0 is designed to operate in a variety of temperature ranges, with a maximum operating temperature of 85°C. The device has a minimum operating temperature of -40°C and is designed to maintain thermal dissipation performance over a wide range of temperature variations.

The ATS-P1-157-C3-R0 is a versatile device that can be used in many different applications. It can be used as a passive cooling device in applications such as cooling computer components, providing additional cooling for air conditioners, and reducing noise levels in audio equipment. Additionally, the device is well-suited for active cooling applications such as cooling power supplies and providing cooling for industrial machines.

The ATS-P1-157-C3-R0 is an ideal choice for applications which require excellent heat dissipation performance. Its compact, lightweight design allows for low-cost and reliable operation, which makes it an excellent choice for a wide variety of applications. Additionally, the device\'s three-stage heat sink design enhances its heat transfer capabilities, allowing for higher levels of heat dissipation from the device.

The specific data is subject to PDF, and the above content is for reference

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