ATS-P1-16-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks have been used in a variety of applications for decades. They are utilized mainly in applications where air cooling solutions are either not practical or not feasible, such as in aircraft, computer and electronic enclosures, and other enclosed or isolated systems. In these applications, the thermal management of heat sinks becomes critical and significant advancements in heat sink technology continue to be developed. ATS-P1-16-C3-R0 is a type of thermal-heat sink, and in this article, we will discuss the application field and working principle of this specific device.

Application Field

ATS-P1-16-C3-R0 is an thermal-heat sink specifically developed for air-cooled, enclosed and isolated systems. It is designed to provide reliable, efficient cooling in an enclosed or in an isolated application with limited airflow. Its performance is comparable to larger, more costly, and more complicated air cooling solutions and therefore it should be considered a cost-effective and reliable alternative.The ATS-P1-16-C3-R0 heat sink is designed with two distinct components, each with its own unique characteristics. The first component is the main body of the heat sink which is composed of aluminum. The aluminum material enhances the thermal transfer process and provides a highly efficient thermal transfer solution. The second component is the active element which is a copper block integrated into the center of the heat sink. The copper, which features higher thermal conduction, enables the heat to be transferred more effectively than with just aluminum alone.The ATS-P1-16-C3-R0 thermal-heat sink can be used in a variety of applications including, but not limited to, embedded systems, communications, telecommunications, aerospace, power, and automobile applications.

Working Principle

The basic design principle behind ATS-P1-16-C3-R0 lies in its ability to transmit the heat generated by components to the outside of the system in a reliable and efficient manner. The aluminum body and the integrated copper block together absorb the heat generated by the components in the system. This heat is then turned into thermal energy as it travels through the aluminum body and the copper block. The thermal energy is then released into the outside environment, thus providing efficient cooling and thermal management.To further enhance the thermal transfer capability, the ATS-P1-16-C3-R0 features a process called “heat-sinking” which helps to increase the rate at which the thermal energy is released. Through this process, the heat-sink is able to rapidly transmit thermal energy away from the system components and thus provides reliable thermal management.In addition to the heat-sinking feature, the ATS-P1-16-C3-R0 is designed to incorporate a fan for active cooling. The fan is crucial for systems which require higher levels of cooling. The fan is able to provide additional cooling capabilities by providing a steady and continuous flow of air around the system components. This helps to keep the system components cool and running at optimal levels.Finally, the ATS-P1-16-C3-R0 is designed for enhanced reliability and durability. It is able to withstand temperatures up to 175°F, making it an ideal solution for many of today\'s thermal management needs.

Conclusion

The ATS-P1-16-C3-R0 thermal-heat sink is an ideal solution for devices operating in air-cooled, enclosed or isolated systems. It is designed to provide superior thermal management and cooling capabilities while maintaining a cost-effective and reliable solution. The aluminum body and integrated copper block combine to allow for efficient thermal transfer, while the integrated fan provides additional cooling capabilities. Finally, the ATS-P1-16-C3-R0 is designed to withstand temperatures up to 175°F, making it a reliable and durable choice for many thermal management solutions.

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