| Allicdata Part #: | ATS36506-ND |
| Manufacturer Part#: |
ATS-P1-160-C2-R0 |
| Price: | $ 4.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-160-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.96900 |
| 10 +: | $ 3.86316 |
| 25 +: | $ 3.64871 |
| 50 +: | $ 3.43400 |
| 100 +: | $ 3.21943 |
| 250 +: | $ 3.00480 |
| 500 +: | $ 2.79017 |
| 1000 +: | $ 2.73651 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is an essential component in many areas of engineering and commercial operation due to the large amount of heat produced by many pieces of equipment. The ATS-P1-160-C2-R0 is a special type of thermal heat sink specifically engineered to provide superior cooling performance within compact confines. In this article, we will look at the application field and working principle of the ATS-P1-160-C2-R0 thermal heat sink.
The primary application field of the ATS-P1-160-C2-R0 thermal heat sink is in the powering of high-power electronic components such as servers and industrial machines. This type of heat sink is also often used in large-scale server farms and data centers where it is necessary to keep the components cooled to operate efficiently. The ATS-P1-160-C2-R0 is also suitable for use within telecommunications applications and in inertial navigation systems, as these require high performance and reliability.
In the world of thermal engineering, the ATS-P1-160-C2-R0 thermal heat sink has a number of features that make it well suited for the application field described above. Firstly, its frame has a high thermal conductivity of 216W/m-K. This ensures that it can dissipate heat from its components faster than other types of heat sinks, making it ideal for applications that require large amounts of heat to be removed. Secondly, the ATS-P1-160-C2-R0 also has a low profile design which means it can be used in compact spaces while still offering excellent cooling performance.
Now that we have a better idea of the application field of the ATS-P1-160-C2-R0 thermal heat sink, it is worth exploring the working principle of the device. In a nutshell, this type of heat sink works by using the principles of thermodynamics to transfer the generated heat away from its components. Thermodynamics is a branch of physics which explains the flow of heat between two different objects as a result of their temperature difference. In the case of the ATS-P1-160-C2-R0, this thermal flow is created when heat is generated by its components, and this heat is then transferred away from the components by the thermal heat sink.
The ATS-P1-160-C2-R0 thermal heat sink works by using the combination of thermodynamics and its design features to transfer heat away from the components as quickly and safely as possible. Firstly, the heat is transferred via the process of conduction: metal frames conduct heat well and this heat is then transferred away from the components by the frame and its fins. Secondly, the heat is transferred via the process of convection: the fins of the heat sink act as a platform upon which air will flow, taking the heat from the components and transferring it away from the device. Finally, the heat is also transferred via radiation—the surface of the heat sink and its fins radiate heat away from the components, cooling them down effectively.
In conclusion, the ATS-P1-160-C2-R0 thermal heat sink is designed to provide superior cooling performance within compact confines and its application fields include powering high-power electronic components, server farms and data centers, telecommunications and inertial navigation systems. This exceptional thermal heat sink works by using thermodynamics to transfer generated heat away from its components via conduction, convection and radiation.
The specific data is subject to PDF, and the above content is for reference