| Allicdata Part #: | ATS36507-ND |
| Manufacturer Part#: |
ATS-P1-161-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-161-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.04460 |
| 10 +: | $ 3.93246 |
| 25 +: | $ 3.71423 |
| 50 +: | $ 3.49574 |
| 100 +: | $ 3.27726 |
| 250 +: | $ 3.05878 |
| 500 +: | $ 2.84029 |
| 1000 +: | $ 2.78567 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important component of almost all modern electronic systems. They serve essential functions of dissipating the heat generated by the system\'s electrical components. The ATS-P1-161-C2-R0 is a high efficiency thermal heat sink, designed to eradicate large amounts of heat from electronic systems while still maintaining high performance and reliability.
Heat Sink Construction
The ATS-P1-161-C2-R0 consists of a top metal plate which is sealed against the board using screws. The bottom of the sink is made of a copper or aluminum base, which has a heat spreader, a finned surface that is used to maximize the heat dissipation from the device. The middle part of the ATS-P1-161-C2-R0 contains a hollow volume of air, wherein a variety of slats and grooves run along the surface of the sink. This creates a superior thermal pathway that provides an effective way to dissipate the heat created by the device.
Components of the Heat Sink
The ATS-P1-161-C2-R0 features a variety of components, such as a thermal pad, thermoset gasket, and fan shroud. The thermal pad is an insulating material which is used to transfer heat from the component being cooled to the metal heat sink. The thermal pad also helps to prevent electrical shorting between components and the heat sink. The gasket is a thin layer of insulation that is placed between the components and the heat sink. This layer prevents metal-on-metal contact between the components and the heat sink. Finally, the fan shroud helps to ensure that the air is moving evenly across the sink, thus reducing the amount of hot spots.
Application Field and Working Principle
The ATS-P1-161-C2-R0 is designed for applications that involve dissipating large amounts of heat from electronic systems. These systems include CPUs, GPUs, digital signal processors, memory, and other high-heat-generation components. The ATS-P1-161-C2-R0 uses a combination of heat transfer principles to dissipate the heat. The thermal pad conducts heat energy from the source to the heat sink, and the fan shroud helps to evenly distribute the air around the sink, reducing the build up of hot spots. The grooves and slats on the surface of the heat sink allow air to flow in multiple directions, creating a greater surface area than a flat surface. This allows more efficient heat transfer from the hot components to the ambient air.
Conclusion
The ATS-P1-161-C2-R0 is a high efficiency thermal heat sink, designed for dissipating heat from a variety of components in electronic systems. The efficient construction of the heat sink, combined with the thermal pad, gasket, and fan shroud, ensure an effective heat dissipation process. The grooves and slats on the sink, along with the fan shroud, create an increased surface area and improved air flow for more efficient heat transfer.
The specific data is subject to PDF, and the above content is for reference