ATS-P1-17-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-P1-17-C1-R0-ND

Manufacturer Part#:

ATS-P1-17-C1-R0

Price: $ 3.42
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-P1-17-C1-R0 datasheetATS-P1-17-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.10275
30 +: $ 3.01896
50 +: $ 2.85125
100 +: $ 2.68349
250 +: $ 2.51579
500 +: $ 2.43193
1000 +: $ 2.18034
Stock 1000Can Ship Immediately
$ 3.42
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.42°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an essential part of modern electronics. Heat is generated by electrical components and, unless removed, will cause components to overheat, leading to damage or system failure. Heat sinks are an important tool for controlling this heat buildup and ensuring the efficiency, reliability, and longevity of electronics. The ATS-P1-17-C1-R0 heat sink is an excellent option for dissipating heat generated by electronic components.

The ATS-P1-17-C1-R0 is a natural convection heat sink, meaning that it uses the natural rise and fall of surrounding air to help cool components. The body of the heat sink is made of aluminum, which is an excellent conductor of heat and provides an efficient and lightweight dissipater. The aluminum also provides an excellent surface for the mounting of components, allowing for easy assembly and installation.

The ATS-P1-17-C1-R0 has a large, open surface area. This large surface area helps to maximize the amount of heat transfer that occurs between the heat sink and the environment. The large surface area also prevents the heat sink from becoming clogged with dust or other particles, which can reduce the efficiency of the heat sink. The ATS-P1-17-C1-R0 also has an integrated fan, which helps to further enhance the cooling performance of the heat sink by circulating the air around the components.

The ATS-P1-17-C1-R0 is an ideal choice for cooling a variety of electronic components. It is suitable for use with low-power components up to 160 watts, such as DIP (Dual In-Line Package) sockets, power transistors, and microprocessors. Additionally, the ATS-P1-17-C1-R0 is suitable for applications such as industrial control cabinets, medical electronics, computers, laptops, and video controllers.

The working principle of the ATS-P1-17-C1-R0 heat sink is simple. When the heat sink is mounted to a circuit board, the heat generated by the components underneath is transferred to the aluminum body of the heat sink. The aluminum body of the heat sink then dissipates this heat into the surrounding environment by natural convection.

The fan integrated into the ATS-P1-17-C1-R0 further enhances the efficiency of the heat sink by pushing air around the components and through the heat sink. This helps to further dissipate the heat into the environment. In addition, the fan helps to keep the components cool by circulating cool air around them.

In summary, the ATS-P1-17-C1-R0 is an excellent choice for thermal management in a variety of electronic applications. Its natural convection cooling design and integrated fan make it an ideal choice for a wide range of components and applications. With its lightweight aluminum body and large surface area, the ATS-P1-17-C1-R0 provides efficient and reliable heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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