| Allicdata Part #: | ATS-P1-172-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-172-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-172-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an increasingly important consideration for electronics designers in many industries today. The ATS-P1-172-C3-R0 heat sink is designed to meet the increasing demand for efficient thermal management solutions for a wide range of applications. This article will discuss the application field and working principle of the ATS-P1-172-C3-R0 heat sinks.
The ATS-P1-172-C3-R0 heat sink is designed for use in a variety of electronics, including applications that utilize power components such as integrated circuits, transistors, diodes, thyristors, triacs, and silicon controlled rectifiers (SCRs). The ATS-P1-172-C3-R0 is also well-suited for use in automotive electronics, telecommunications, consumer electronics, and industrial electronics. The design of the heat sink is optimized for maximum efficiency in the performance of removing heat from these components.
The ATS-P1-172-C3-R0 heat sink is a finned aluminum extrusion. The fin design provides a high rate of thermal conduction from the heat generating components to the surface area larger than the component itself. This allows for a rapid dissipation of the generated heat. The extruded aluminum also provides a robust platform, resistant to environmental conditions and mechanical wear.
The working principle of the heat sink is based on the laws of thermodynamics. Heat is generated by the components in the system and seeks to move from the component to the surrounding environment. By increasing the surface area exposed to the environment, it increases the speed at which heat can be transferred. This is achieved by the fin design which allows for a larger surface area exposed to the environment and also helps to promote efficient convective cooling. Heat is then forced away from the heat sink by convection, aided by the fin design.
In addition, the ATS-P1-172-C3-R0 is designed to be installed in limited space applications. The unit has a small foot-print, making it ideal for those tight space applications. It is also designed to be in contact with the components in the system, and can be mounted using standard brackets and screws.
The ATS-P1-172-C3-R0 is a reliable, efficient, and cost-effective thermal management solution for a wide range of applications. By offering an increased surface area exposed to the environment, it is able to effectively dissipate the heat generated by components in the system. The extruded aluminum provides a robust platform and the fin design allows for convective cooling, allowing for efficient and reliable operation. The ATS-P1-172-C3-R0 heat sink is the perfect solution for those thermally demanding operations where reliability is of utmost importance.
The specific data is subject to PDF, and the above content is for reference