ATS-P1-174-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal solutions have been around since the invention of the steam engine. Heat sinks, in particular, have been used to improve the performance of electronic components by conducting heat away from them and dissipating it away from the system. Heat sinks are generally used in either active or passive configurations, which involve fans or other cooling devices, depending on the application. The ATS-P1-174-C1-R0 is an example of a passive heat sink, which utilizes a combination of conduction, convection, and radiation to regulate the temperature of electronic components.

Application Field and Working Principle

The ATS-P1-174-C1-R0 is a passive heat sink, so it requires no external cooling devices such as fans or pumps. Instead, it relies on the combination of conduction, convection, and radiation to dissipate heat away from the electronics. The ATS-P1-174-C1-R0 is designed to be used in a variety of application fields such as industrial, medical, telecommunications, military, and aerospace. The working principle of the ATS-P1-174-C1-R0 is based on the laws of thermodynamics. Heat from the electronic components is conducted through the heat sink and then dissipated away from the system through convection and radiation. The ATS-P1-174-C1-R0 utilizes an open-frame design for maximum airflow and efficiency of convective heat transfer. The heat sink has a number of fins that are designed to increase the surface area in direct contact with the ambient air, thus increasing the rate of convection. The thermal conductivity of the heat sink is also enhanced by the use of a material such as aluminum, which is an excellent conductor of heat. The radiation capabilities of the ATS-P1-174-C1-R0 are also important. The radiative component of the heat sink is the material itself, which is designed to absorb and release heat. This effect is enhanced by the use of an open-frame design, which exposes more of the material to the environment and allows the heat to be released more efficiently. In addition, the heat sink is designed to be coated with a material that absorbs and emits light, which further increases the radiative efficiency of the heat sink.

Design Features

The ATS-P1-174-C1-R0 is an example of a passive heat sink that uses a combination of conduction, convection, and radiation to regulate the temperature of the system. The heat sink is designed to be used in a variety of application fields such as industrial, medical, telecommunications, military, and aerospace. The open-frame design of the heat sink ensures maximum efficiency of convective heat transfer and allows for a more effective use of radiant heat transfer. The aluminium material of the heat sink aids in the thermal conductivity and ensures good heat dissipation. The coated material of the heat sink increases the radiative efficiency of the heat sink.

Conclusion

The ATS-P1-174-C1-R0 is an example of a passive heat sink that utilizes a combination of conduction, convection, and radiation to dissipate heat away from the electronic components. The open-frame design of the heat sink increases the surface area in direct contact with the ambient air, thus increasing the rate of convective heat transfer. The aluminium material of the heat sink acts as an excellent conductor of heat and increases the thermal conductivity of the heat sink. The coated material of the heat sink absorbs and releases light, further increasing the radiative efficiency of the heat sink. The ATS-P1-174-C1-R0 is designed to be used in a variety of applications and is a reliable and efficient solution for dissipating heat away from the electronics in your system.

The specific data is subject to PDF, and the above content is for reference