| Allicdata Part #: | ATS-P1-191-C1-R0-ND |
| Manufacturer Part#: |
ATS-P1-191-C1-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-191-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a critical role in a wide range of electronic areas. Heat sinks are commonly used to reduce temperatures in a wide variety of applications by dissipating heat away from internal components to improve performance at the same time. The ATS-P1-191-C1-R0 heat sink is designed to be used in a wide range of industrial and commercial applications.
The thermal resistance performance of this heat sink is generally improved when a fan is used with it. For this reason, it is often used in combination with a fan, increasing its total cooling capacity. These components can be configured to operate together in either a horizontal or vertical orientation to best suit specific application requirements. The heat sink is also easy to install on the board, consistent with the design, and ensures reliable and efficient thermal performance.
The ATS-P1-191-C1-R0 heat sink has a flat, aluminum-dissipating base connected to fins through which air can pass. The fins are designed to increase the surface area of the heat sink by creating more pathways for air circulation. The fins also have slots to maximize air flow, dissipating heat more quickly and efficiently. This design allows the heat sink to maximize its total cooling capacity.
In addition, the heat sink comes with a variety of features that make it easy to install and use. For instance, it has an adjustable pressure spring that holds the heat sink firmly in place on the board. This helps to ensure that the heat sink maintains a secure fit, and that it does not slip or vibrate, further improving its cooling capabilities. It also features an integrated thermal pad that provides a reliable and efficient thermal interface between the heat sink and the device it is cooling.
The ATS-P1-191-C1-R0 heat sink also features a simple and cost-effective design that makes it relatively easy to manufacture. It is available in a range of sizes, shapes, and materials, allowing for a better fit to the application being cooled. In addition, its modular design also makes assembly and installation relatively easy.
The ATS-P1-191-C1-R0 heat sink is designed to provide dependable cooling performance in a wide range of applications. Its efficient design helps to ensure consistent thermal performance and longevity in operation. Its simple and cost-effective design also makes it a preferred choice for many applications where cooling is critical.
The specific data is subject to PDF, and the above content is for reference