| Allicdata Part #: | ATS-P1-193-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-193-C3-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-193-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are heat transfer components which help dissipate thermal energy away from temperature-sensitive components such as CPUs, transistors and other semiconductor equipment. The ATS-P1-193-C3-R0 is a thermal heat sink designed for use in a variety of applications. The ATS-P1-193-C3-R0 features a range of customized high-performance thermal materials including aluminum and copper, which enable it to provide superior thermal performance.
The ATS-P1-193-C3-R0 is specifically designed to effectively cool component temperatures in power converter applications, such as hybrid electric vehicle inverters, radiation cooling applications, and high-powered electronics cooling. The design includes an innovative dual-phase heat conduction system which utilizes both convection cooling and conduction cooling to maximize thermal performance and extend the life of temperature-sensitive components.
The working principle of the ATS-P1-193-C3-R0 is simple yet effective. It consists of a series of fins or louvers that are arranged in an alternating pattern to maximize thermal performance and conduction cooling. The fins and louvers effectively increase the surface area of the heat sink, allowing for greater heat exchange between air and the surface of the sink. The fin layout is designed to optimize air circulation and ensure uniform cooling of the component.
The ATS-P1-193-C3-R0 is a high-performance heat sink that can be used in a wide variety of applications. It is designed for power converter applications, radiation cooling applications, and high-powered electronics cooling. In addition, it can be used as a heatsink for heatsink and cooling system applications. Its advanced design ensures that it can provide superior thermal performance and extended life of temperature-sensitive components.
The specific data is subject to PDF, and the above content is for reference