ATS-P1-20-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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<p><b>What is the ATS-P1-20-C1-R0? </b></p><p>The ATS-P1-20-C1-R0 is a thermal-heat sink application designed to dissipate and control heat generated by electronic components. It is well-designed for applications requiring reliable, low-cost thermal solutions.</p><p><b>ATS-P1-20-C1-R0 Application Field </b></p><p>The ATS-P1-20-C1-R0 is applicable for any thermal management tasks where rely and low-cost solutions are required. It can be used in many applications, including digital signal processing, storage devices, LED lighting, and automotive and industrial control systems. Furthermore, due to its easily configurable design, the ATS-P1-20-C1-R0 is suitable for cooling a wide range of components, ranging from low-power microprocessors to high-power transistors.</p><p><b>ATS-P1-20-C1-R0 Working Principle </b></p><p>The ATS-P1-20-C1-R0 utilizes a natural convective flow of air to dissipate and control thermal energy. The device is designed so that air is drawn into one or more input ports via the natural convective flow (stack effect) of air, which is driven by the thermal difference between the internal and external temperatures. As air is drawn in, it passes through various obstacles inside the device, such as heat sinks and secondary cooling elements, before it is eventually forced out through the external exhaust port(s). The obstacles inside the device act as heat sinks, providing additional heat dissipation. In addition, secondary cooling elements, such as fans, are used to further increase the device\'s efficiency in dissipating heat. By controlling airflow with a combination of convective and secondary cooling elements, the heat generated by electronic components can be effectively managed. </p><p>When correctly configured, the ATS-P1-20-C1-R0 is proven to be a reliable thermal solution. By using an efficient airflow system, the device efficiently removes heat from electronic components, providing an ideal solution for applications requiring reliable and low-cost thermal control.</p>

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