| Allicdata Part #: | ATS-P1-201-C1-R0-ND |
| Manufacturer Part#: |
ATS-P1-201-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-201-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.15°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an incredibly important part of modern technologies, and are necessary in order to protect components from overheating and damaging temperatures. The ATS-P1-201-C1-R0 is a specific type of heat sink that has its own unique range of applications and working principles. The article will look at these two aspects in-depth to provide readers with a comprehensive overview of the product.
Application Field
At its most generic level, a thermal-heat sink is a device used to transfer heat away from a hotter object, usually until the object reaches a desired temperature. The ATS-P1-201-C1-R0 is a particular heat sink that is commonly used in electronic applications and in consumer appliances. This particular model is designed to help with the cooling of devices such as LEDs for lighting, capacitors in amplifier circuits, and transistors in cell phone circuits. In addition to that, the ATS-P1-201-C1-R0 is also used for overclocking CPUs for gaming PCs, to prevent them from over-heating.
Specific materials are used in the construction of the ATS-P1-201-C1-R0 heat sink. Its base is made up of aluminum and its top is made out of copper, meaning it is an excellent conductor of heat. Its shape is also designed to effectively create airflow, which is important as it allows for increased heat dissipation.
Working Principle
The ATS-P1-201-C1-R0 works based on the principles of thermodynamics. In short, it works by using air-convection to transfer the heat of the hotter device away and into the air surrounding the device. The heat sink is filled with fins, which the air passes through, and these fins are linked to their own individual heat pipes. These pipes take the heat away and transfer it out into the air surrounding the device using convection. This is an effective method of cooling as it prevents the object from reaching dangerously high temperatures which could cause it to become damaged.
In addition to air-convection, the ATS-P1-201-C1-R0 also uses evaporation as a way of cooling. This method works by using a liquid chemical in the heat sink, which evaporates when it is exposed to heat, as it takes heat away from the object when it does so. This is an effective way of cooling as the evaporating liquid takes away significantly more heat than air convection alone.
Conclusion
Overall, the ATS-P1-201-C1-R0 is an incredibly useful heat sink model that can be used for a variety of applications. Its aluminum and copper construction provide excellent thermal conductivity, while its fins and heat pipes ensure effective air-convection and evaporation cooling from the heat generated by the device. As such, the ATS-P1-201-C1-R0 is the ideal choice for electronic cooling systems.
The specific data is subject to PDF, and the above content is for reference