| Allicdata Part #: | ATS-P1-22-C1-R0-ND |
| Manufacturer Part#: |
ATS-P1-22-C1-R0 |
| Price: | $ 3.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-22-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.60864 |
| 30 +: | $ 3.40830 |
| 50 +: | $ 3.20783 |
| 100 +: | $ 3.00737 |
| 250 +: | $ 2.80687 |
| 500 +: | $ 2.60639 |
| 1000 +: | $ 2.55626 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-P1-22-C1-R0 heat sink is an efficient cooling device optimized for thermal management in a wide variety of applications. This product is designed to dissipate and manage heat build-up within electronic circuits, while providing structural rigidity to ensure stability and reliability. With its industry-leading thermal performance and robust construction, the ATS-P1-22-C1-R0 heat sink is an ideal choice for thermal management of electrical/electronic equipment.
The ATS-P1-22-C1-R0 heat sink is constructed from high-quality aluminum and features an optimized fin design. These features combine to deliver superior performance and long-lasting reliability even in the harshest environment or toughest applications. The fin design helps to improve air flow and increase the surface area of the device, allowing for effective cooling in even the most demanding conditions. The strong construction also ensures durability, making the device suitable for use in even the toughest conditions or applications.
The ATS-P1-22-C1-R0 heat sink uses a combination of convection and radiation heat dissipation. Convection is the movement of air over a surface, while radiation is the transfer of heat energy through the atmosphere or through the material of the heat sink itself. In the ATS-P1-22-C1-R0 device, the fins act as a radiating surface, providing a large surface area to dissipate heat energy into the surrounding environment. Meanwhile, the internal structure of the device is designed to promote air flow, allowing for effective thermal transfer.
The ATS-P1-22-C1-R0 heat sink also features integrated heat pipes with a patented cooling system that combines both direct and indirect cooling. This allows for the efficient localized cooling of components, allowing for increased performance and power management. The efficient heat pipes and cooling system also reduce the size of the heat sink, allowing for a more compact, lightweight, and cost-effective product.
Due to its robust construction and industry-leading thermal performance, the ATS-P1-22-C1-R0 heat sink is an ideal choice for thermal management in a wide variety of applications. These include servers, laptop and desktop computers, routers, power supplies, and any other electronics device that requires efficient thermal management. This product is also highly reliable and suitable for use in harsh environmental conditions, making it the perfect choice for applications that require high levels of durability and reliability.
The specific data is subject to PDF, and the above content is for reference