| Allicdata Part #: | ATS-P1-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-28-C3-R0 |
| Price: | $ 7.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.52365 |
| 30 +: | $ 6.16119 |
| 50 +: | $ 5.79877 |
| 100 +: | $ 5.43640 |
| 250 +: | $ 5.07397 |
| 500 +: | $ 4.71155 |
| 1000 +: | $ 4.62094 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important components of the modern electronics industry, as it helps to improve system reliability, efficiency, and longevity. Heat sinks are used to dissipate or dissipate heat. Heat is generated by electric current as it passes through the electrical circuit. The heat must be removed away from sensitive components or the surrounding area, and the heat sink provides the necessary thermal transfer mechanism. The ATS-P1-28-C3-R0 heat sink is one such product designed to perform this task.
The ATS-P1-28-C3-R0 is a heavy-duty heat sink that is designed for applications that require higher levels of thermal dissipation and for use in harsh environmental conditions. The design of the heat sink is such that it has a large surface area and is able to dissipate a considerable amount of heat. The unit is made of high-quality aluminum alloy that is highly resistant to wear and corrosion. It is also designed to allow for easy installation and removal, as well as maintenance.
The ATS-P1-28-C3-R0 is designed to provide cooling in a variety of applications, including computers, power supplies, LEDs, power amplifiers, and automotive electronics. It has a large surface area that allows for efficient cooling, and it is capable of dissipating heat in both short and long-term periods. This makes it suitable for applications where long-term reliability is a must. The design also includes a patented airflow design that helps optimize air flow for greater efficiency and longer life.
The working principle of the ATS-P1-28-C3-R0 heat sink is similar to many other heat sink designs. The heat generated by the electrical components is transferred to the heat sink, where it is dissipated. The heat is then dispersed into the surrounding air and dissipated into the environment. This process helps to keep the temperature of the components and the surrounding environment under optimal levels.
The ATS-P1-28-C3-R0 heat sink is a great choice for applications that require reliable and efficient cooling. It is capable of dissipating a considerable amount of heat, and its large surface area helps optimize thermal performance. Furthermore, the design allows for easy installation and removal, as well as maintenance. With its efficient design, the ATS-P1-28-C3-R0 is an excellent choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference