| Allicdata Part #: | ATS-P1-64-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-64-C3-R0 |
| Price: | $ 4.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-64-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.71322 |
| 30 +: | $ 3.50658 |
| 50 +: | $ 3.30044 |
| 100 +: | $ 3.09412 |
| 250 +: | $ 2.88784 |
| 500 +: | $ 2.68157 |
| 1000 +: | $ 2.63000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink is a kind of device designed to remove heat from a component or an area which experiences high levels of thermal energy. It is used to cool electronic components, or to transfer heat away from sensitive areas in order to prevent damage. The ATS-P1-64-C3-R0 is a thermal heat sink designed with aluminium fins to quickly dissipate heat from internal components in an electronics system. The heat sink is equipped with a copper base plate and is one of the most efficient thermal solutions available in the market.
Application Field of ATS-P1-64-C3-R0
The ATS-P1-64-C3-R0 is an ideal solution for the thermal dissipation of electronic components in equipment that is subjected to extreme operating conditions. The product offers excellent thermal performance within a compact size and is compatible with components that dissipate up to 15 W of heat. It can be used in a wide range of applications, including LED lighting, intelligent instrumentation, industrial automation, power supplies, power conversion, and medical electronics. The product is ideal for cooling high-power electronic devices such as CPUs, GPU’s, DSP’s, and FPGA’s, making it an essential component for any computer system.
Working Principle of ATS-P1-64-C3-R0
The working principle of the ATS-P1-64-C3-R0 thermal heat sink is based on heat conduction. Heat is transferred from the surface of the heat sink to the surrounding environment by the combination of aluminium fins and a copper base plate. The aluminium fins dissipate the heat from the copper base plate and direct it away from sensitive components. The fin design increases the rate of heat dissipation compared to other materials, allowing the device to quickly cool down hot spots. The heat sink is designed with a high temperature silicone thermal interface material to ensure that the heat is evenly distributed throughout the device.
The ATS-P1-64-C3-R0 is designed to effectively and efficiently dissipate heat from components in an electronics system. The fin design ensures that heat is quickly directed away from sensitive components. Additionally, the copper base plate and high temperature silicone thermal interface material ensure that heat is evenly distributed throughout the device. The product is an ideal thermal solution for a wide range of applications, making it a must-have for anyone requiring superior thermal performance.
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