| Allicdata Part #: | ATS-P1-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-65-C3-R0 |
| Price: | $ 4.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.94443 |
| 30 +: | $ 3.72519 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential for the effective and safe operation of most electrical equipment. The ATS-P1-65-C3-R0 is a thermal and heat sink solution that stands out from the rest due to its robust design and reliable performance. This heat sink belongs to the Plastic Fin Heat Sink Series with a metal base. Its plastic fins allow for optimal airflow while still providing efficient thermal management.
The ATS-P1-65-C3-R0 features an all-aluminum construction that is both lightweight yet robust. Its design consists of extruded aluminum and a multi-fin array that provides ample surface area for efficient heat dissipation. The fins are arranged in a pattern to provide maximum contact with the air flow while encouraging unimpeded airflow through and around the heat sink. This allows for a great balance of heat dissipation while still limiting bulk.
The ATS-P1-65-C3-R0 is suitable for a wide range of applications, such as electronics cooling, thermal transfer, or heat dissipation. Its extensive operating temperature range allows the heat sink to perform reliably in gaming consoles, digital video recorders, and other home or industrial electronics. The flexibility of the heat sink also makes it suitable for use in many types of computer hardware and similar applications.
The power used by the ATS-P1-65-C3-R0 is also low, making it an ideal choice for use in high-performance, power-sensitive applications. This heat sink utilizes a special heat dissipation technique known as conduction and convection. This technique utilizes the present air flow to absorb and release the heat that has been generated by the electronics system.
The ATS-P1-65-C3-R0 features a finned surface that can be tailored to fit any given application. This allows for a greater thermal transfer capability, as well as improved thermal performance. It also offers greater design flexibility and allows manufacturers to customize the heat sink for their specific needs. This helps reduce the cost of producing custom heat sinks.
In addition to its superior performance, the ATS-P1-65-C3-R0 also offers a unique solution for effective temperature management. Its slim profile allows it to fit in tighter spaces, while its open structure provides ample cooling capacity. This allows the heat sink to effectively cool a large area without relying on additional cooling components.
The ATS-P1-65-C3-R0 is an ideal thermal and heat sink solution, offering efficient and reliable performance for a wide range of applications. Its robust design, lightweight construction and flexible design make it the perfect choice for cost-effective and reliable temperature management. With its multiple fin design, it provides ample surface area for efficient heat dissipation while promoting unimpeded airflow and low operating temperatures.
The specific data is subject to PDF, and the above content is for reference