| Allicdata Part #: | ATS-P1-67-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-67-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-67-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components in a range of electronic devices. ATS-P1-67-C3-R0 is a high power heat sink designed to move heat away from a device. It is suited for cooling applications in consumer electronics, industrial environments, and more.
The design of the ATS-P1-67-C3-R0 includes a profiled aluminum flange with a copper insert for optimal heat transfer. The copper insert is designed with an advanced fin structure which increases surface area resulting in improved airflow and increased heat dissipation. The design also features an extended fin length which increases air volume over the fin and reduces the risk of air pockets developing around the fin. This design reduces the thermal resistance between the surface and the air, allowing for efficient heat dissipation.
The aluminum flange and copper insert of the ATS-P1-67-C3-R0 are designed to facilitate quick and easy assembly. The flange is designed with a press-fit mounting pattern that allows it to be easily mounted on a device without needing any additional hardware. The fin structure is also designed with a mounting notch to eliminate any gaps between the flange and the fin. This feature eliminates any potential weak spots in the design and further improves heat dissipation.
The ATS-P1-67-C3-R0 also features a low profile design which minimizes contact with other components, making it well suited for use in tight spaces. It also features an anodized alumina finish which is lightweight and which further reduces the risk of warping or damage to the fins.
The ATS-P1-67-C3-R0 is designed to provide effective and efficient cooling for a range of electronic devices. Its robust design is suited to applications in industries where reliability and reliability are key. Its low profile design and anodized alumina finish make it well suited for use in areas where space is limited and durability required. Furthermore, its unique fin structure provides superior performance compared to other heat sinks, making it an ideal choice for cooling applications.
The specific data is subject to PDF, and the above content is for reference