| Allicdata Part #: | ATS-P1-86-C1-R0-ND |
| Manufacturer Part#: |
ATS-P1-86-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-86-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermally enhanced devices or units designed to dissipate heat generated for electrical/electronic components, usually those with integrated circuits or other active components requiring additional cooling to reduce component failures or shorten life spans. Heat sinks are typically mounted on the top of the component to provide cooling and reduce the thermal resistance of the heated component. The ATS-P1-86-C1-R0 is a heat sink used in a variety of applications.
The ATS-P1-86-C1-R0 thermal-heat sink is a thermoelectric based heat sink. This type of heat sink uses a metal frame made from a high thermal conductivity material such as copper or aluminum. The frame serves as a base to which thermal transfer plates having a series of fin-shaped elements are bonded. The fins are designed to increase the surface area of the heat sink, resulting in an increased transfer rate of heat from the component to the heat sink. The fins also aid in the dissipation of heat from the device.
The ATS-P1-86-C1-R0 heat sink is designed with a special air intake system, which allows air to circulate around the component, aiding in the dissipation of heat from the device. The heat sink also features cooling fins that are shaped and oriented to create an air tunnel that helps draw air through the unit and out the rear, thereby creating a continuous air flow. This helps to keep the component cool and helps to reduce the thermal load on the device, thereby increasing the life of the component.
The ATS-P1-86-C1-R0 heat sink can be used in a variety of applications, such as those involving integrated circuits, LEDs, and other active components with large heat dissipation requirements. This type of heat sink is especially useful for applications where space is limited, as its compact design allows for easy installation and compatibility with other components. Additionally, its low thermal resistance makes it more effective at dissipating heat away from active components.
The ATS-P1-86-C1-R0 heat sink is an effective solution for cooling integrated circuits, LEDs, and other active components. It is designed with a special air intake system and cooling fins to help draw air through the unit, creating a continuous air flow that cools the component and reduces thermal load. The compact design makes the heat sink easy to install and compatible with other components, while its low thermal resistance makes it particularly effective at dissipating heat away from active components.
The specific data is subject to PDF, and the above content is for reference