| Allicdata Part #: | ATS-P1-89-C3-R0-ND |
| Manufacturer Part#: |
ATS-P1-89-C3-R0 |
| Price: | $ 4.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P1-89-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.67794 |
| 30 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks often play a critical role in controlling the temperature of electronic systems. The ATS-P1-89-C3-R0 is one such product, designed to enable efficient cooling by providing a highly reliable solution for natural convection cooling. The sink is particularly suited to SBC, CPU, GPU, FPGA, lithium-ion battery, and other semiconductor applications.
Using an aluminum-rich construction, this heat sink provides reliable performance and high thermal conductivity. The sink comes with an array of integrated copper fins that attach to the base through a patented spike design. Coupled with the sink’s low profile shape, the fins allow for efficient heat transfer to the surrounding environment.
The ATS-P1-89-C3-R0 provides a temperature gradient between the base and fins which greatly enhances heat dissipation. The aluminum alloy used for the sink’s construction is also corrosion-resistant and offers long service life. This is further compounded by the black finish, which reduces the amount of dust and grime the sink can attract.
Heat transfer is further supported by the ATS-P1-89-C3-R0’s thermal resistance technology, which drastically reduces convection resistance. The thermal resistance ensures that the hottest parts of the heat sink remain cooler, increasing heat dissipation even further.
Overall, the ATS-P1-89-C3-R0 provides an efficient solution for natural convection cooling. Its combination of durable construction, superior heat dissipation, and thermal resistance technology make it suitable for a range of electronics applications. With its lightweight construction, easy installation process, and low profile design, the ATS-P1-89-C3-R0 is an effective solution for cooling electronic systems.
The specific data is subject to PDF, and the above content is for reference