ATS-P2-07-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-P2-07-C1-R0-ND

Manufacturer Part#:

ATS-P2-07-C1-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-P2-07-C1-R0 datasheetATS-P2-07-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices used in electronics to facilitate the transfer of heat away from sensitive components. They are commonly used when considerable heat is dissipated from components in the form of radiation, convection, or conduction. In particular, they are used to cool circuit boards, power supplies, and other electronics. The ATS-P2-07-C1-R0 is a thermal – heat sink designed to offer improved efficiency and performance through a wide range of applications. In this article we will explore the application of the ATS-P2-07-C1-R0 and its working principle.

ATS-P2-07-C1-R0 Application Field

The ATS-P2-07-C1-R0 is a high-efficiency thermal heat sink designed for use in applications where heat is generated off-board, such as in industrial, automotive, and medical electronics. The device is designed to provide uniform heat distribution and low thermal resistance, thus improving the performance and reliability of the circuitry. The ATS-P2-07-C1-R0 is also well suited for use in applications where there are limited airflow and enclosure space, such as in confined spaces with limited ventilation.

The ATS-P2-07-C1-R0 offers a wide selection of mounting options, such as fixed and screwed, making it suitable for applications where mounting is a challenge. It also offers a variety of base sizes to allow for greater flexibility, enabling the use of a wide range of cooling solutions. Additionally, the device is capable of operating within a wide temperature range, making it suitable for use in a variety of applications.

Working Principle of ATS-P2-07-C1-R0 Heat Sink

The ATS-P2-07-C1-R0, like all thermal heat sinks, works by dissipating heat from sensitive components into the surrounding environment. The profiled fins that make up the heat sink increase the surface area, allowing the heat to be dissipated more effectively. The thermal resistance of the device is further improved by the addition of a thermal paste or thermal pad, to enable better thermal conductivity between the component and the heat sink.

The ATS-P2-07-C1-R0’s design also ensures that the heat generated by the component is evenly distributed, eliminating hot spots. This allows a greater amount of heat to be transferred away, improving the performance and reliability of the component. The design also ensures that air flow remains consistent within the entire system, aiding in the cooling process. Finally, the use of an aluminum alloy enhances the thermal conductivity of the heat sink, further reducing its thermal resistance.

Conclusion

In conclusion, the ATS-P2-07-C1-R0 is an ideal thermal – heat sink solution for applications that require improved heat dissipation efficiency and performance. Its design and materials make it well suited for use in applications where space and airflow are limited, while its versatile mounting options enable the use of a wide range of cooling solutions. Additionally, its improved thermal conductivity makes it an ideal choice for use in applications where the heat generated must be dissipated quickly and reliably. Finally, the ATS-P2-07-C1-R0’s low thermal resistance makes it suitable for advanced applications that require improved efficiency and performance.

The specific data is subject to PDF, and the above content is for reference

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