| Allicdata Part #: | ATS-P2-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-P2-10-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components commonly used to dissipate large amounts of heat generated by electronic components. ATS-P2-10-C1-R0 is a type of heat sink designed to be used in a variety of applications. It is made from a combination of aluminum and copper alloy material, making it both lightweight and effective at dissipating heat. This article will explore the typical application fields and work principles of the ATS-P2-10-C1-R0 heat sink.
The ATS-P2-10-C1-R0 heat sink is often used in a wide variety of applications. This includes applications involving mobile phones, computers, servers, LED lighting, home appliances, digital media players, and industrial equipment. It can also be used for cooling high-power electronics, such as CPUs, GPUs, and high-end processors. As the name implies, it is particularly suited for environments which require high power efficiency and minimal heat buildup.
The ATS-P2-10-C1-R0 heat sink is designed to work by drawing heat away from the source of heat and dissipating it into the environment. This is achieved by the system of fins and air vents incorporated into the design of the heat sink. This allows a certain amount of air to flow through and over the fins, which help to dissipate the heat away from the source. The aluminum and copper alloy materials that make up the fins also help with heat transfer, as the metals are efficient conductive materials.
In terms of installation, the ATS-P2-10-C1-R0 heat sink is usually mounted on the source components with a series of screws. The fins of the heat sink should be spaced apart evenly to ensure an efficient flow of air is achieved. It is also important to note that the fins must not be clogged up with dust or debris, as this will affect the performance of the heat sink. If the fins do become clogged it is recommended that the debris or dust is removed to ensure optimal performance.
The ATS-P2-10-C1-R0 heat sink is an effective and efficient solution for cooling high-powered electronics in demanding environments. It combines lightweight aluminum and copper alloy to provide effective heat transfer and dissipation, allowing it to keep components running cool even in extremely hot conditions. This makes it a great option for a variety of applications, from mobile phones to gaming consoles and industrial equipment.
The specific data is subject to PDF, and the above content is for reference