| Allicdata Part #: | ATS-P2-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-12-C3-R0 |
| Price: | $ 4.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.82851 |
| 30 +: | $ 3.61599 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal-heat sink technology of the ATS-P2-12-C3-R0 is designed specifically to support components with strictly controlled heat outputs. Its main application areas are in thermal management, power dissipation and cooling applications. In the context of thermal management, this technology helps to ensure that components are sufficiently cooled to function optimally. On the other hand, in applications related to power dissipation, it helps dissipate heat from components in order to avoid any potential damage due to overheating.
The thermal-heat sink technology of ATS-P2-12-C3-R0 utilizes an internal forced-air cooling system. This system uses a number of fan blades to move air through the heat sink. The fan blades are connected to a motor and as this motor rotates, the fan blades move air at a certain speed. This forced air flow passes through the series of metal fins inside the heat sink, collecting and dissipating the heat from the component. This process helps to control the temperature of the component.
Besides utilising forced air cooling system, this technology also uses special materials to enhance the cooling performance. These materials have high thermal conductivity, which contributes to better heat dispersal. Some of these materials are aluminum, copper or stainless steel. They act as heat spreaders within the heat sink, helping to transfer heat away from the component more efficiently.
The ATS-P2-12-C3-R0 technology also features a unique fan design which ensures that the air flow is evenly distributed across the entire surface of the heat sink. This helps to improve the cooling performance and ensures that the component does not suffer from any kind of hotspot related anomalies. The fan design also helps to reduce the noise produced by the device. The fan is designed to produce low-noise operation, which helps minimize any disruption caused by the cooling device.
In terms of power efficiency, the ATS-P2-12-C3-R0 technology is quite efficient. It is designed to consume less power compared to other thermal-heat sink technologies. In addition, the heat sink is designed to be lightweight and compact, thereby making it easy to integrate into any system. Furthermore, the technology also comes with a wide variety of performance levels, allowing users to choose one that fits their needs and requirements.
Overall, the ATS-P2-12-C3-R0 thermal-heat sink technology is ideal for components with strictly controlled heat outputs. It makes use of a number of factors to help maximise cooling performance, while also ensuring that the component does not suffer from any hotspot related anomalies. This technology also offers a unique fan design which helps to evenly distribute the air flow, reduce the noise produced and maintain a low-power consumption. As such, this technology is one of the most reliable thermal management solutions available.
The specific data is subject to PDF, and the above content is for reference