ATS-P2-136-C1-R0

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Thermal management is an important factor in many electronic, electrical, and industrial applications. Heat sinks provide an effective way to move heat away from circuitry and parts and dissipate it into the surrounding environment. The ATS-P2-136-C1-R0 thermal heat sink is a specialized heat cooling solution designed for mission critical applications.

The ATS-P2-136-C1-R0 is a two-stage, extruded heat sink developed specifically for large, critical applications. It is compatible with a wide range of platform sizes including Intel® Xeon™ or AMD Opteron® processor families when combined with a copper base mount. It features a two-stage thermal design that allows for both air cooling and liquid cooling to be used depending on the power requirement and application. The first stage of the heat sink uses a multiple-fin construction to promote a greater rate of airflow across the surface area. The second stage is a larger pin fin design that is designed to move more air for larger power requirements. The design also makes the heat sink compatible with a range of fan systems and mounting points.

The design of the ATS-P2-136-C1-R0 ensures efficient thermal transfer which will reduce the amount of system down time. It is designed to provide maximum thermal performance at a minimal operating noise level. The heat sink also utilizes a unique anchoring system that helps to ensure that the heat sink remains securely attached to the processor. The construction also allows for the thermal characteristics of the heat sink to be adjusted to account for varying levels of temperature and environmental conditions.

The ATS-P2-136-C1-R0 thermal heat sink is a reliable solution for high-performance, long-term usage. It is engineered to manage heat loads while maintaining high reliability and excellent performance in the toughest of mission critical applications. Its robust construction makes it suitable for use in extreme temperature, shock, and vibration environments. It is also designed with a self-contained mechanical mounting system which makes it easy to install and maintain. It is able to outperform traditional heat sinks in either air or liquid cooling environments.

The ATS-P2-136-C1-R0 is an ideal choice for mission critical applications, large data centers, and other extreme environment applications. It is able to provide the thermal management performance required to keep processors operating within the necessary temperature range while providing exceptional reliability and performance. The two-stage design increases the airflow and promotes better heat transfer, increasing longevity and reliability. Its unique mounting system offers excellent stability, preventing any premature wear or tear on the processor.

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