| Allicdata Part #: | ATS-P2-165-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-165-C3-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-165-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical component of any electronics circuit, as the excess heat that the components generate can lead to electrical malfunctions and even system failure. The ATS-P2-165-C3-R0 heat sink is an advanced passive cooling system designed to dissipate heat from components and circuits. The heat sink can be used in a wide range of applications and provides a cost-effective solution for managing the thermal needs of electronic systems.
The ATS-P2-165-C3-R0 heat sink is a extrudbar heat sink. This type of heat sink is made from a single extruded bar of aluminum, which is CNC machined to shape and then anodized to provide corrosion and wear resistance. The design of this heat sink is optimized to ensure maximum heat transfer and air flow to the system. It features a fin stack design with punched perforations for efficient heat dissipation, which helps to reduce system temperatures. The heat sink also has a built-in fan for further active cooling.
The primary application of the ATS-P2-165-C3-R0 heat sink is in telecommunications and networking, where it is used to manage and dissipate the heat generated by electronic components and circuits. It can also be used for computer systems, such as servers and desktop PCs, as well as for industrial electronics and medical systems.
The working principle behind the ATS-P2-165-C3-R0 heat sink is simple: heat from the components and circuits is conducted through the heat sink, which is then dissipated into the surrounding air. The design of the heat sink is optimized to ensure maximum thermal transfer to the air, which helps to reduce the temperature of the system. In addition, the built-in fan helps to ensure that the air within the system is constantly being circulated, further increasing the efficiency of the heat sink.
The ATS-P2-165-C3-R0 heat sink is an efficient and reliable way to manage the thermal needs of electronic systems, as it is specifically designed to provide optimal cooling for a wide range of applications. With its high performance and cost-effective design, it is an ideal solution for managing the thermal needs of electronic components and circuits.
The specific data is subject to PDF, and the above content is for reference