| Allicdata Part #: | ATS-P2-169-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-169-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-169-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.22266 |
| 50 +: | $ 3.03307 |
| 100 +: | $ 2.84350 |
| 250 +: | $ 2.65394 |
| 500 +: | $ 2.46437 |
| 1000 +: | $ 2.41698 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important part of any device operating in high temperatures. A heat sink is a passive cooling device that draws energy away from an electronic component and dissipates it into the surrounding environment, thus preventing thermal damage and extending the life of the product. The ATS-P2-169-C3-R0 is a thermal heat sink designed to provide superior thermal management for any application that operates in high temperatures.
The ATS-P2-169-C3-R0 is a highly effective thermal heat sink for thermal management applications that operate in high temperatures. It is designed with a wide range of options, including various sizes and materials. This ensures that the heat sink is able to provide the optimal cooling solution for almost any application. The ATS-P2-169-C3-R0 is constructed from an aluminum alloy that is machined and polished for superior thermodynamic performance.
The ATS-P2-169-C3-R0 is designed for the purpose of dissipating heat quickly and efficiently. The heat sink employs a massive fin surface area that increases the rate of heat dissipation and helps to reduce the temperature of the component while in operation. The heat sink also has several built-in features that help to promote better airflow and draw away the heat more quickly. These features include a unique fin design, an integrated fan, and a specialized ribbing pattern. The ribbing pattern increases the surface area for more efficient cooling and helps to reduce noise levels.
The ATS-P2-169-C3-R0 has a wide range of application fields that make it a great choice for computers, medical equipment, industrial machinery, or any other electronic device that needs superior thermal management. The heat sink is also ideal for mission-critical applications that require a reliable and efficient cooling solution. The heat sink is designed to be compact and light-weight, making it easy to install and requiring less space than other models. Additionally, the heat sink has an extra-long thermal pad that ensures optimum contact, and minimal thermal resistance between the heat sink and the component.
The ATS-P2-169-C3-R0 is a reliable and efficient thermal heat sink that provides superior thermal management for a wide range of applications. Its large fin surface area ensures a more rapid heat dissipation rate, while its various options and features ensure that the heat sink is well suited for the requirements of each application. As a result, the ATS-P2-169-C3-R0 is an excellent choice for those looking for a highly effective thermal heat sink for their high-temperature applications.
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