| Allicdata Part #: | ATS-P2-176-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-176-C3-R0 |
| Price: | $ 4.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-176-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.67794 |
| 30 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.73°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions today come in a variety of forms. The ATS-P2-176-C3-R0 is an example of a compact and efficient heat sink that utilizes an innovative design and construction to provide powerful thermal management. This heat sink, designed and manufactured by Akasa, has become one of the most popular thermal solutions in the industry today.
The ATS-P2-176-C3-R0 is a heat sink designed to provide both air and liquid cooling. Its construction consists of an aluminum fin stack which is fitted over a copper base, providing the highest levels of thermal conductivity. This allows the heat generated by a CPU or other electronic components to be efficiently and effectively dissipated away from the component. The ATS-P2-176-C3-R0 can be used to cool up to two components at a time, and its design allows for the use of a fan, if desired.
This heat sink also features a unique feature known as the "Flux Paths". This design feature enables faster, more efficient air flow through the heat sink, resulting in better heat dissipation. The ATS-P2-176-C3-R0 also has cutouts in the base to allow for the use of a thermal paste, if desired. This ensures the best possible contact between the heat sink and the component, allowing for optimal heat dissipation.
The ATS-P2-176-C3-R0 is ideal for use in a variety of applications. It is particularly well suited for use in servers and other heat generating computing devices. Its efficient design makes it great for applications that require the highest levels of cooling efficiency. It can also be used in industrial and automotive applications, as well as in audio/visual and consumer electronics.
In addition to providing exceptional heat dissipation, the ATS-P2-176-C3-R0 is also capable of providing efficient and reliable power and distribution. Its advanced design ensures that both the power supply and data cables are correctly linked to the thermal module, allowing for stable and safe operation of the system. This ensures that all components receive the same level of power and distribution, allowing for more efficient operation of the entire system.
Overall, the ATS-P2-176-C3-R0 is a powerful and efficient thermal solution that offers exceptional levels of cooling and power distribution. Its unique design allows for both air and liquid cooling, ensuring maximum heat dissipation. In addition, its advanced design ensures that the heat sink is securely mounted to the component, and its flux paths ensure that the air flows evenly through the heat sink. Finally, its reliable and efficient power and distribution capabilities make it ideal for use in a variety of applications.
The specific data is subject to PDF, and the above content is for reference