| Allicdata Part #: | ATS-P2-179-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-179-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-179-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.90978 |
| 30 +: | $ 3.69243 |
| 50 +: | $ 3.47521 |
| 100 +: | $ 3.25798 |
| 250 +: | $ 3.04079 |
| 500 +: | $ 2.82358 |
| 1000 +: | $ 2.76928 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a type of heat transfer equipment used for cooling electronic components and devices that dissipate large amounts of heat, such as CPUs. The ATS-P2-179-C3-R0 heat sink is a combination of energy-saving heat sinks that have the unique ability to reduce the operating temperature of an enclosed system by transferring heat away from the heat generating component and dissipating it in the surrounding air. This heat sink uses advanced technology to increase its thermal conductivity and reduce heat spreading.
The ATS-P2-179-C3-R0 is a die-cast and stamped aluminum heat sink that has the unique ability to transfer heat energy efficiently to the surrounding air without the need for additional cooling such as air conditioners. It has excellent heat dissipation properties and is designed to achieve the lowest possible temperature. It is ideal for applications where high thermal conductivity is needed and long-term operation without significant deterioration of performance is desired. It also has a low profile design which helps to minimize the system\'s footprint.
The ATS-P2-179-C3-R0 heat sink is widely used in the electronics and computer industry as it is the most cost-effective option for providing thermal management. It is typically found in applications such as CPUs, graphics cards, and other integrated circuits that require low operating temperatures. The heat sink consists of aluminum fins, which spread the heat quickly and effectively, and a base plate, which acts as a heat conductor for the heat sink to effectively dissipate and transfer heat away from the hot components. The fins are also designed to provide additional surface area for heat transfer, which helps to increase the overall efficiency of the heat sink.
The ATS-P2-179-C3-R0 thermal solution works on the principle of heat transfer and operates by convection. The fins of the heat sink are designed to allow air to circulate through them and dissipate heat away from the component and away from the system. The heat conducted away from the component is then diffused in the surrounding air. The aluminum fins are designed to maximize the air volume in order to maximize the heat transfer efficiency.
The ATS-P2-179-C3-R0 is a low cost and efficient thermal solution that can be used to cool a variety of system components. It is designed to operate in a range of operating temperatures and is designed to achieve the highest amount of thermal transfer possible. It is lightweight, durable, and easy to install, making it an ideal choice for a variety of applications. The heat sink is a great choice for those looking for an efficient and cost-effective way to keep their systems running cool.
The specific data is subject to PDF, and the above content is for reference