| Allicdata Part #: | ATS-P2-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-P2-20-C1-R0 |
| Price: | $ 4.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.87513 |
| 30 +: | $ 3.65967 |
| 50 +: | $ 3.44434 |
| 100 +: | $ 3.22906 |
| 250 +: | $ 3.01379 |
| 500 +: | $ 2.79852 |
| 1000 +: | $ 2.74471 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-P2-20-C1-R0 thermal heat sinks are specialized electronic components used to dissipate heat from other components in a wide variety of electronic equipment. They are commonly used in computers, telecom systems, and other industrial and consumer electronics.
Application field
The application field of ATS-P2-20-C1-R0 thermal heat sinks is broad and can include most consumer electronics as well as industrial, medical and military applications. They can be used in computers, mobile phones, networking equipment, as well as specialized medical imaging equipment and other high power industrial applications.
The primary application for thermal heat sinks is the cooling of electronic components and devices. They are often used to keep the temperature of delicate components at an acceptable level so that they can function properly without damage. This is especially important in areas like modern consumer electronics, which are often designed to work within tight budgetary constraints where component cost is a distinct priority.
Working principle
The basic working principle of ATS-P2-20-C1-R0 thermal heat sinks is simple. Heat from hot components is radiated away from the source and away from the surroundings. This is possible due to the superior thermal conductivity of the material and carefully designed fins or other structures that increase the surface area for radiating heat. The heat is then dissipated away from the components, usually through passive convection or forced air cooling.
The thermal resistance is one of the most important characteristics of thermal heat sinks which indicates how effective the device is at dissipating heat. The lower the thermal resistance, the higher the heat transfer rate, which is desirable. The dimensions of the device as well as the material construction can greatly affect thermal resistance.
Thermal heat sinks are also often used in combination with active cooling systems, such as fans, water cooling systems, or even liquid nitrogen. By using these active cooling systems, the heat transfer rate can be increased and the overall cooling performance greatly improved.
Conclusion
ATS-P2-20-C1-R0 thermal heat sinks are powerful and versatile electronic components used in a variety of applications. They are used to effectively dissipate heat away from hot components, keeping them at a safe operating temperature. The thermal resistance of the device is one of the most important characteristics, as it determines how effectively it can transfer heat. Thermal heat sinks can also be used in combination with other cooling systems for even more efficient heat transfer.
The specific data is subject to PDF, and the above content is for reference