| Allicdata Part #: | ATS1857-ND |
| Manufacturer Part#: |
ATS-P2-20-C2-R0 |
| Price: | $ 5.22 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-20-C2-R0 Datasheet/PDF |
| Quantity: | 90 |
| 1 +: | $ 4.74390 |
| 10 +: | $ 4.61601 |
| 25 +: | $ 4.35935 |
| 50 +: | $ 4.10281 |
| 100 +: | $ 3.84646 |
| 250 +: | $ 3.59002 |
| 500 +: | $ 3.33358 |
| 1000 +: | $ 3.26947 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices found in many electrical and electronic components whose function is to dissipate the heat generated by these components during operation. The ATS-P2-20-C2-R0 is a type of heat sink designed expressly to meet the heat dissipation requirements of such components.
The primary function of a heat sink is to provide a large thermal surface area in which heat generated by the component can be readily conducted away from the component and dissipated into the surrounding environment. The ATS-P2-20-C2-R0 is a large, single-piece heat sink which utilizes a combination of convection and conduction to maximize the heat dissipation efficiency.
The ATS-P2-20-C2-R0 is designed to be attached directly to the component and surface it is dissipating heat from. The precise surface-to-heat sink mounting method is a factor of the specific component and operating environment, but the most common application is a thermal compound between the heat sink and the component surface. This ensures excellent conductance between the two and allows the heat dissipation from the component to begin almost immediately.
The ATS-P2-20-C2-R0 has a base made of aluminum extrusion which is designed to provide maximum strength and stress relief from the heat sink mounting. The extruded aluminum base is also machined and anodized to provide a perfect and highly effective thermal interface with the component. At the same time, the base is heat-treated to maximize its strength and resistance to thermal shock.
Once the component is securely attached to the heat sink, thermal energy generated during operation is conducted through the aluminum extrusion and then dissipated into the environment via convection and conduction. The heat sink is designed with specific fin widths and heights, as well as an arrangement of multiple fins to optimize surface-area-to-volume ratio. This allows for maximum heat dissipation without sacrificing strength or durability. The fin profile design also minimizes the possibility of recirculation of hot air and ensures the maximum efficiency of heat conduction.
The ATS-P2-20-C2-R0 heat sink is an innovative and highly efficient solution for cooling components such as processors, switches, and power supplies. It enables the component to operate at its peak performance, while also providing long-term durability and reliability. By providing an effective means of heat dissipation, the heat sink ensures that the component can stay within its specified temperature range and provides a stable platform for optimal operation.
The specific data is subject to PDF, and the above content is for reference