| Allicdata Part #: | ATS-P2-24-C1-R0-ND |
| Manufacturer Part#: |
ATS-P2-24-C1-R0 |
| Price: | $ 4.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-24-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.33755 |
| 30 +: | $ 4.09668 |
| 50 +: | $ 3.85560 |
| 100 +: | $ 3.61463 |
| 250 +: | $ 3.37365 |
| 500 +: | $ 3.13267 |
| 1000 +: | $ 3.07243 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are commonly used in electronic applications to transfer heat away from sensitive components and disperse it into the surrounding environment. Thermal management is important for reliably maintaining the performance and prolonging the lifetime of electronic circuits.
The ATS-P2-24-C1-R0 is an advanced heat sink designed to dissipate heat from a wide variety of applications. It is constructed from a special aluminum material with a cupped, tapered shape that improves heat transfer capabilities. The aluminum is also treated with a surface coating for anti-corrosion protection and improved thermal efficiency. The ATS-P2-24-C1-R0 features two large, extended fins that are separate from each other, allowing for improved airflow and a greater heat dissipation surface.
The heat sink features an innovative design that enables it to function in a wide variety of applications. It can be used to cool components such as DSPs, processors, ASICs, infrared cameras, and LEDs. The heat sink can be mounted on component surfaces using standard mounting clips, or can be installed on a solid surface using screws. It is compatible with a wide range of electronic products and is designed to handle continuous operating temperatures up to 150°C.
The basic working principle of the ATS-P2-24-C1-R0 heat sink is to transfer heat away from the heat source, such as an electronic component, and dissipate it into the surrounding environment. Heat sinks are designed to take advantage of convection currents, meaning that as air or other fluids move across the surface, they absorb heat from it and carry it away from the source. The process of transferring the heat from the source to the environment is known as heat dissipation.
The ATS-P2-24-C1-R0 heat sink employs a special cross-flow design, which allows for increased cooling efficiency and better heat dissipation. This design maximizes the surface area of the heat sink and uses fins to better dissipate the heat from the source. The fins also create turbulence in air flow, which helps to provide more efficient cooling.
The ATS-P2-24-C1-R0 heat sink is a highly efficient thermal solution designed to provide maximum cooling performance in a variety of applications. Its innovative design and robust construction make it an ideal solution for cooling sensitive electronic components and prolonging the life of circuits. The heat sink is also easy to install and is compatible with a wide range of devices, making it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference