| Allicdata Part #: | ATS-P2-29-C1-R0-ND |
| Manufacturer Part#: |
ATS-P2-29-C1-R0 |
| Price: | $ 7.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-29-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.39639 |
| 30 +: | $ 6.04107 |
| 50 +: | $ 5.68575 |
| 100 +: | $ 5.33037 |
| 250 +: | $ 4.97501 |
| 500 +: | $ 4.61965 |
| 1000 +: | $ 4.53081 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-P2-29-C1-R0 application field and working principle are utilized in the Thermal – Heat Sink category. They are designed to effectively transfer thermal energy from a high temperature surface to a cooler source. Heat sinks are commonly used in industrial and electronic cooling applications to help keep components cool and prevent overheating.
A heat sink is a device that absorbs excessive heat from a hot surface and dissipates it into the surrounding environment. It is a metal or plastic object that has a large surface area which is in contact with the hot surface. Heat is dispersed by the large surface area of the heat sink, which is transverse to the heat source, thereby allowing thermal energy to dissipate quickly.
The ATS-P2-29-C1-R0 device is a high-efficiency heat sink ideally suited for use in electronic and industrial applications. It is made from a combination of aluminum and copper that provides superior thermal performance. The ATS-P2-29-C1-R0 has a unique design that utilizes multiple layers of aluminum and copper fins for effective heat dissipation.
The fin design of the ATS-P2-29-C1-R0 provides an efficient air flow, resulting in the highest thermal performance and minimal air velocity loss. Both of these characteristics are crucial to dissipating heat efficiently. The aluminum and copper combination of the ATS-P2-29-C1-R0 provide superior thermal conductivity that helps reduce thermal resistance, resulting in a more efficient heat sink.
The ATS-P2-29-C1-R0 also features an enclosed back plate design, which helps to reduce air flow resistance and maximize thermal performance. Additionally, the enclosed back plate also helps to reduce air turbulence from the heat sink, allowing the device to operate at a higher efficiency without generating additional noises.
The ATS-P2-29-C1-R0 is highly reliable and easy to install. It is designed to be low profile and lightweight, making it incredibly easy to integrate with existing equipment. The ATS-P2-29-C1-R0 is also compatible with various voltage sources, so it can be used in many different applications.
In conclusion, the ATS-P2-29-C1-R0 is an ideal solution for electronic and industrial cooling applications. It has a unique fin design that provides an efficient air flow for maximized thermal performance. Additionally, the ATS-P2-29-C1-R0 is highly reliable and easy to install, making it perfect for use in any application.
The specific data is subject to PDF, and the above content is for reference