| Allicdata Part #: | ATS-P2-31-C3-R0-ND |
| Manufacturer Part#: |
ATS-P2-31-C3-R0 |
| Price: | $ 6.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X5.84MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-31-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.47092 |
| 30 +: | $ 5.16705 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a vital element in many electronic devices. They are designed to control the temperature of the device and enhance its performance. The ATS-P2-31-C3-R0 heat sink is particularly well-suited for applications requiring targeting and dense cooling due to its compact size. It is able to provide a range of temperature characteristics for any required thermal environment, offering high thermal transfer efficiency and reliable operation of the device.
The ATS-P2-31-C3-R0 consists of a highly efficient copper base and multiple aluminum fins for maximum heat extraction. The heat sink is designed to target concentrated amounts of heat, while its compact size helps to save space. It features a unique system of multiple levels of cooling which efficiently removes heat from the device quickly and without loss of cooling performance.
The ATS-P2-31-C3-R0 is designed to be easily mounted with mounting screws and can be configured for any device or application. This heat sink works by drawing heat away from the device it is cooling. The heat that is collected is then dispersed into the environment. This makes it an ideal choice for applications that require lasting heat dissipation in tight spaces.
The ATS-P2-31-C3-R0 heat sink utilizes a system of thermal conductivity to ensure maximum efficiency and safe operation. The heat sink dissipates heat away from the device using a combination of direct and indirect contact with the device as well as airflow. This ensures that the device is running at its optimal temperature for optimal performance.
The ATS-P2-31-C3-R0 is designed to be highly reliable and be able to withstand extreme temperatures. This makes it ideal for use in extreme and difficult environments. It provides maximum heat transfer capability without sacrificing reliability and durability. It is designed to withstand and work successfully in high vibration environments and can easily handle any harsh conditions.
The ATS-P2-31-C3-R0 heat sink is ideal for densely populated devices and applications where targeting and dense cooling are required. Its efficient design and reliable performance make it the perfect choice for any device that requires targeted cooling and heat dissipation in limited space. The heat sink will provide efficient cooling and performance even in the harshest environments.
The specific data is subject to PDF, and the above content is for reference