ATS-P2-41-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.02°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction Thermal-heat sinks have a huge range of application fields, where their main purpose is to ensure efficient dissipation of thermal energy generated by electrical and electronic components. There are various types of these sinks available to suit different needs and environments, from large-scaled systems to smaller, desktop systems. The ATS-P2-41-C1-R0 heat sink, among the most commonly used of them, has the ability to dissipate heat quickly, with high-end performance, and it is known for its complete compatibility with various components. Therefore, it is considered one of the most reliable and well-designed components that can be used across different environments. Description The ATS-P2-41-C1-R0 heat sink is a high-end product that includes features such as a large surface area, which allows for greater heat dissipation, a thermal gap-filler, and a secure clamping system. It is suitable for both large-scale and medium-scale systems, and is designed to fit a variety of components. Its dimensions are as follows: length of 58 millimetres, width of 40 millimetres, and height of 16 millimetres. Its material is usually copper, which allows for superior heat transfer. Application FieldThe application fields for ATS-P2-41-C1-R0 heat sinks are manifold. Firstly, they are the preferred choice for computer systems that have significant workloads, large or small. The larger dimensions of the heat sinks can accommodate larger surface area, which ensures optimal heat dissipation throughout the system. Furthermore, they are used for applications, such as industrial automation and automation of transportation systems, where efficient heat dissipation is mainly required. The heat sink is also regularly used in the cooling of high-end/advanced electronic components, such as cameras, processors, and mainboards in computers, as well as other high-end components. Working Principle/FeaturesThe ATS-P2-41-C1-R0 heat sink follows a simple working principle: it transfers thermal energy away from sensitive electronic components with an extremely low temperature. This is done by the presence of a large surface area that dissipates heat efficiently and quickly. The surface area is created by a mechanical process known as ‘stamping’ and involves two simple operations: drilling and machining. The heat sink also works on the principle of attaching itself securely with components, and it does so using a thermal gap-filler and a clamping system. The thermal gap-filler is basically a thin sheet of material applied between the heat sink and components. The heat sink also features a high-end copper material that allows for rapid heat transfer and a large number of holes, which improve its thermal performance. Moreover, the fanless design of the ATS-P2-41-C1-R0 heat sink is known to provide efficient, silent cooling to components. Conclusion The ATS-P2-41-C1-R0 heat sink is a reliable, efficient, and user-friendly thermal solution for various applications and system sizes. It is by far one of the most efficient heat sinks on the market, featuring superior features such as a large surface area that ensures efficient thermal energy transfer in multiple environments, a unique clamping system that ensures secure fitting, and a fanless design that promotes silent cooling. Moreover, its body is designed to perfectly fit a variety of components and thus ensures optimal thermal performance all throughout. With such features and characteristics, the ATS-P2-41-C1-R0 heat sink stands out as the preferred choice among large enterprises, data centres, and professional users alike.

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