ATS-P2-47-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-P2-47-C3-R0-ND

Manufacturer Part#:

ATS-P2-47-C3-R0

Price: $ 4.05
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X30MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-P2-47-C3-R0 datasheetATS-P2-47-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.67794
30 +: $ 3.47382
50 +: $ 3.26957
100 +: $ 3.06520
250 +: $ 2.86086
500 +: $ 2.65651
1000 +: $ 2.60542
Stock 1000Can Ship Immediately
$ 4.05
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com


The thermal heat sink is an indispensable component of most electronic products nowadays. Typically, it’s a metal plate with shapes cut into it: usually a finned plate, which is designed to dissipate heat away from the source, resulting in more efficient performance and longer product life.
The ATS-P2-47-C3-R0 is one such heat sink, designed for use in various applications. Its structure consists of extruded aluminum construction, giving it superior heat dissipation capability over other sinks. The product is typically mounted to a board or other device, using a mounting bracket or screws. It then has a metal base plate on which a series of stacked fins are placed. These fins, which are made from extruded aluminum, help to increase the surface area of the heat sink, making heat transfer much more efficient.
In terms of the working principle, this kind of heat sink is quite simple. Heat generated from a device is transferred to the surface of the heat sink via the metal base plate. The fins act as a cooling medium, dissipating the heat to the surrounding environment through convection. The surface area of the fins is key in this process, allowing more heat to be transferred from the device and thereby cooling it down swiftly. This is especially useful for applications such as computing devices, where heat can be generated in a relatively short period of time.
The ATS-P2-47-C3-R0 heat sink is designed for applications where loads are higher than typical desktop and laptop computers, such as server applications or gaming consoles. It can handle higher temperatures and higher-powered devices, meaning that more heat will be dissipated very efficiently. The product is also designed to be shockproof and corrosion-free.
In conclusion, the ATS-P2-47-C3-R0 heat sink is an excellent choice for applications of all kinds, due to its superior heat dissipation capabilities. Its extruded aluminum construction ensures the product is robust and long-lasting, while the large surface area of the fins allows for maximum heat transfer. It is suitable for a range of applications, from home computers to enterprise-level servers, and its shockproof and corrosion-free properties make it a safe and reliable choice for your next project.

The specific data is subject to PDF, and the above content is for reference

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