| Allicdata Part #: | ATS-P2-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-P2-73-C1-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical aspect of modern electronics design. As power budgets go up, dissipated heat and heat load become more of an issue. In order to ensure optimal system performance without system failure, thermal management solutions need to be incorporated into the design from the outset. ATS-P2-73-C1-R0 thermal solutions are designed to do just that.
The ATS-P2-73-C1-R0 is a heat sink specific solution that is designed to transfer heat away from high-power electronics and dissipate it into the air, resulting in improved thermal performance. The solution uses passive cooling, meaning there is no active fan or other external cooling fluid system in place. The heat sink is designed to be a low profile, low height solution that minimizes the impact on the board space. The solution also utilizes a copper pin grid array (CPGA) design that helps with heat transfer from the integrated circuit to the heat sink.
The working principle of the ATS-P2-73-C1-R0 thermal solutions is based on the principles of thermodynamics. Heat is the result of energy conversion and can be transferred in one of three ways: radiation, conduction, or convection. In the case of the ATS-P2-73-C1-R0, most of the heat transfer takes place by conduction. The copper pin grid array helps to maximize the thermal conductivity from the heatsink to the surrounding air. The thermal resistance of the heatsink is further reduced by the use of a thermal conducting tape between its base and the base of the integrated circuit.
The ATS-P2-73-C1-R0 thermal solution provides an excellent opportunity to improve the thermal performance of electronic systems. Given its low profile design, it’s a great solution for high power applications where space constraints are an issue. The copper pin grid array helps to maximize heat transfer from the integrated circuit to the heatsink while the thermal conducting tape reduces resistance to further improve thermal efficiency.
Overall, the ATS-P2-73-C1-R0 provides a great packaging solution for thermal management. It is an easy to install, low profile solution that provides improved thermal performance in a variety of electronic systems. The ATS-P2-73-C1-R0 thermal solution is an ideal solution for improving system performance by efficiently dissipating heat from the integrated circuit and away from the system.
The specific data is subject to PDF, and the above content is for reference